Stress induced delamination methods for the study of adhesion of Pt thin films to Si

Acta Materialia

Volumn 52, Issue 7, 2004, Pages 2081-2093

  Lee, Alan ^a   Clemens, B M ^a   Nix, W D ^a  

^a Stanford University   (United States)

Author keywords

Adhesion; Blister; Delamination; Mode mixity; Nanoindentation; Pt sputtering; Spalling; Telephone cords

Indexed keywords

ADHESION; COMPUTATIONAL METHODS; CRACK INITIATION; DELAMINATION; ION BEAMS; SPALLING; SPUTTERING; STRESSES; SURFACE PHENOMENA; TELEPHONE CORDS; THIN FILMS; TOUGHNESS;

BLISTER; MODE MIXITY; NANOINDENTATION; PT SPUTTERING;

PLATINUM;

EID: 1842450269     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.actamat.2004.01.003     Document Type: Article

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