Electrical reliability and interfacial adhesion of Cu(Mg) thin films for interconnect process adaptability

Thin Solid Films

Volumn 516, Issue 8, 2008, Pages 2325-2330

  Yi, Seol Min ^a   An, Jung Uk ^a   Hwang, Sang Soo ^a   Yim, Jung Ryoul ^a   Huh, Yong Hak ^b   Park, Young Bae ^c   Joo, Young Chang ^a  

^a Seoul National University   (South Korea)

^b Korea Research Institute of Standards and Science   (South Korea)

^c Andong National University   (South Korea)

Author keywords

Adhesion; Cu(Mg) alloy; Interconnect; Reliability

Indexed keywords

ADHESION; COPPER ALLOYS; ELECTRIC BREAKDOWN; ELECTRIC PROPERTIES; MICROELECTRONICS; RELIABILITY;

INTERFACIAL ADHESION;

THIN FILMS;

EID: 38649124023     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2007.08.134     Document Type: Article

References (19)

1. Murarka S.P. Mater. Sci. Eng., R Rep. 19 (1997) 87
2. Lane M.W., Liniger E.G., and Lloyd J.R. J. Appl. Phys. 93 (2003) 1417
3. Suwwan de Felipe T., Murarka S.P., Bedell S., and Lanford W.A. Thin Solid Films 335 (1998) 49
4. Lee W.H., Cho H.L., Cho B.S., Kim J.Y., Nam W.J., Kim Y.-S., Jung W.G., Kwon H., Lee J.H., Lee J.G., Reucroft P.J., Lee C.M., and Lee E.G. Appl. Phys. Lett. 77 (2000) 2192
5. Takewaki T., Kaihara R., Ohmi T., and Nitta T. International Electron Devices Meeting, Washington DC, U.S.A., Dec. 10-13 1995. Proceeding of International Electron Devices Meeting (1995) 253
6. Lanford W.A., Ding P.J., Wang W., Hymes S., and Muraka S.P. Thin Solid Films 262 (1995) 234
7. Lanford W.A., Ding P.J., Wang W., Hymes S., and Murarka S.P. Mater. Chem. Phys. 41 (1995) 192
8. Frederick M.J., Goswami R., and Ramanath G. J. Appl. Phys. 93 (2003) 5966
9. Frederick M.J., and Ramanath G. J. Appl. Phys. 95 (2004) 363
10. Frederick M.J., and Ramanath G. J. Appl. Phys. 95 (2004) 3202
11. Ma Q., Fujimoto H., Flinn P., Jain V., Adibi-Rizi F., Moghadam F., and Dauskardt R.H. In: Oates A.S., Filter W.F., Rosenberg R., Greer A.L., and Gadepally K. (Eds). Materials Reliability in Microelectronics, San Francisco, U.S.A., April 17-21 1995. Material Research Society Symposium Proceeding vol. 391 (1995) 91
12. Dauskardt R.H., Lane M., Ma Q., and Krishna N. Eng. Fract. Mech. 61 (1998) 141
13. Hwang S.-S., Lee H.-C., Ro H.W., Yoon D.Y., and Joo Y.-C. Appl. Phys. Lett. 87 (2005) (Art. No. 111915)
14. Houk R.S. Anal. Chem. 58 (1986) 97
15. Mayadas F., and Shatzkes M. Phys. Rev., B 1 (1970) 1382
16. J.S. Ahn, M.S. Thesis, College of Engineering, Seoul National University, Korea, 2004.
17. Wu W., Duan X., and Yuan J.S. IEEE International Reliability Physics Symposium, Dallas, U.S.A., March 31- April 3 2003. IEEE international Reliability Physics Proceedings (2003) 282
18. In: Hwang S.S., Jung S.Y., Joo Y.C., Tsui T.Y., Joo Y.C., Michaelson L., Lane M., and Volinsky A.A. (Eds). Materials, Technology and Reliability of Low-k Dielectrics and Copper Interconnects, San Francisco, U.S.A., April 18-21 2006. Material Research Society Symposium Proceeding vol. 914 (2006) 331
19. McBrayer J.D., Swanson R.M., and Sigmon T.W. J. Electrochem. Soc. 133 (1986) 1242