메뉴 건너뛰기




Volumn , Issue , 2010, Pages

Exemplified calculation of stress migration in a 90nm node via structure

Author keywords

[No Author keywords available]

Indexed keywords

90NM NODE; DIRECT CALCULATION; GOOD CORRELATIONS; INDUCED STRESS; MASS FLUX; MIGRATION EFFECTS; REFERENCE TEMPERATURE; SIMULATION AND MEASUREMENT; STRESS DISTRIBUTION; STRESS MIGRATION; STRESS-FREE STATE;

EID: 77953700601     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESIME.2010.5464542     Document Type: Conference Paper
Times cited : (19)

References (22)
  • 1
    • 32244435821 scopus 로고    scopus 로고
    • Copper Interconnect Electromigration Behavior in Various Structures and Precise Bimodal Fitting
    • M. H. Lin, M. T. Lin, et.al: "Copper Interconnect Electromigration Behavior in Various Structures and Precise Bimodal Fitting", Jap. J. Appl. Phys. Vol. 45, No. 2A, 2006, pp. 700-709.
    • (2006) Jap. J. Appl. Phys. , vol.45 , Issue.2 A , pp. 700-709
    • Lin, M.H.1    Lin, M.T.2
  • 3
    • 42649086033 scopus 로고    scopus 로고
    • Effects of length scaling on electromigration in dual-damascene copper interconnects
    • M. H. Lin, M. T. Lin, T. Wang: "Effects of length scaling on electromigration in dual-damascene copper interconnects", Microelectronics Reliability, 48 (2008), pp. 569-577.
    • (2008) Microelectronics Reliability , vol.48 , pp. 569-577
    • Lin, M.H.1    Lin, M.T.2    Wang, T.3
  • 4
    • 34548104313 scopus 로고    scopus 로고
    • Revisit to the finite element modeling of electromigration for narrow interconnects
    • C. M. Tan et.al.: "Revisit to the finite element modeling of electromigration for narrow interconnects", Journal of Applied Physics, 2007, vol. 102, no. 2, pp. 033705-1-7.
    • (2007) Journal of Applied Physics , vol.102 , Issue.2
    • Tan, C.M.1
  • 5
    • 0035456975 scopus 로고    scopus 로고
    • Three-Dimensional Voids Simulation in Chip-level Metallization Structures: A contribution to reliability evaluation
    • D. Dalleau, K. Weide-Zaage: "Three-Dimensional Voids Simulation in Chip-level Metallization Structures: A contribution to reliability evaluation", Micr. Rel. 41 (2001), pp. 1625-1630.
    • (2001) Micr. Rel. , vol.41 , pp. 1625-1630
    • Dalleau, D.1    Weide-Zaage, K.2
  • 6
    • 50249128752 scopus 로고    scopus 로고
    • Determination of Migration Effects in Cu-Via Structures with Respect to Process Induced Stress
    • K. Weide-Zaage, J. Zhao, J. Ciptokusumo, et.al: "Determination of Migration Effects in Cu-Via Structures with Respect to Process Induced Stress", Microelectronics Reliability 48, 2008, pp.1393-1397.
    • (2008) Microelectronics Reliability , vol.48 , pp. 1393-1397
    • Weide-Zaage, K.1    Zhao, J.2    Ciptokusumo, J.3
  • 7
    • 42649144738 scopus 로고    scopus 로고
    • Temperature-dependent stress-induced voiding in dual-damascene Cu interconnects
    • Z. Y. Wu, Y. Y. Tang, et.al.: "Temperature-dependent stress-induced voiding in dual-damascene Cu interconnects", Microelectronics Reliability 48 (2008), pp. 578-583.
    • (2008) Microelectronics Reliability , vol.48 , pp. 578-583
    • Wu, Z.Y.1    Tang, Y.Y.2
  • 8
    • 0032207675 scopus 로고    scopus 로고
    • Electromigration testing of integrated circuit interconnections
    • PII S016793179800272X
    • F. Fantini, J. Lloyd, et.al:"Electromigration testing of integrated circuit interconnections", Microelectronic Engineering 40 (3-4): 207-221, 1998. (Pubitemid 128399920)
    • (1998) Microelectronic Engineering , vol.40 , Issue.3-4 , pp. 207-221
    • Fantini, F.1    Lloyd, J.R.2    De Munari, I.3    Scorzoni, A.4
  • 9
    • 0033907970 scopus 로고    scopus 로고
    • Surface Electromigration in copper interconnects
    • N. D. McCusker, H. Gamble, et.al:" Surface Electromigration in copper interconnects", Microelec. Relia., Vol.40, No.1,2000, pp.69-76.
    • (2000) Microelec. Relia. , vol.40 , Issue.1 , pp. 69-76
    • McCusker, N.D.1    Gamble, H.2
  • 11
    • 0036892397 scopus 로고    scopus 로고
    • Electromigration Reliability Issues in Dual-Damascene Cu Interconnections
    • 12
    • E. T. Ogawa, et.al.: "Electromigration Reliability Issues in Dual-Damascene Cu Interconnections", IEEE Trans. Rel., Vol. 51, No.4, 12/2002, pp.403-420.
    • (2002) IEEE Trans. Rel. , vol.51 , Issue.4 , pp. 403-420
    • Ogawa, E.T.1
  • 14
    • 0001163312 scopus 로고
    • A model for stress-induced metal notching and voiding in very large-scale-integrated Al-Si (1%) metallization
    • J. W. McPherson, C. F. Dunn: "A model for stress-induced metal notching and voiding in very large-scale-integrated Al-Si (1%) metallization" J Vac Sci Technol B5 (1987), pp. 1321-1325.
    • (1987) J Vac Sci Technol , vol.B5 , pp. 1321-1325
    • McPherson, J.W.1    Dunn, C.F.2
  • 15
    • 33847625874 scopus 로고    scopus 로고
    • Stress Migration Phenomenon in Narrow Copper Interconnects
    • T. Suzuki, et. al., "Stress Migration Phenomenon in Narrow Copper Interconnects" J. Appl. Phys. 101 (2007) 044513.
    • (2007) J. Appl. Phys. , vol.101 , pp. 044513
    • Suzuki, T.1
  • 17
    • 77953709567 scopus 로고    scopus 로고
    • Statistical Study of Electromigration Line-width Dependence in Cu/Low-k Interconnects
    • X. Lu, K.-D. Lee, et. al.: "Statistical Study of Electromigration Line-width Dependence in Cu/Low-k Interconnects", AIP, Int. Workshop Stress induced Phenomena, 2004, pp.188-195.
    • AIP, Int. Workshop Stress Induced Phenomena, 2004 , pp. 188-195
    • Lu, X.1    Lee, K.-D.2
  • 19
    • 77950540473 scopus 로고    scopus 로고
    • Structure-dependent behavior of stress-induced voiding in Cu interconnects
    • doi:10.1016/j.tsf.2009.12.093
    • Z. H. Wu, Y.-T. Yang, et.al: " Structure-dependent behavior of stress-induced voiding in Cu interconnects", Thin Solid Films, 2010, doi:10.1016/j.tsf.2009.12.093.
    • (2010) Thin Solid Films
    • Wu, Z.H.1    Yang, Y.-T.2
  • 20
    • 33644921204 scopus 로고    scopus 로고
    • The effect of line width on stress-induced voiding in Cu dual damascene interconnects
    • W. Shao, Z. H. Gan, et.al.: " The effect of line width on stress-induced voiding in Cu dual damascene interconnects", Thin Solid Films, 2006, Vol. 504, pp. 298-301.
    • (2006) Thin Solid Films , vol.504 , pp. 298-301
    • Shao, W.1    Gan, Z.H.2
  • 21
    • 36048963245 scopus 로고    scopus 로고
    • Resistance characterization of Cu stress-induced void migration at narrow metal finger connected with wide line
    • R. C. J. Wang, K. S. Chang-Liao, et.al: " Resistance characterization of Cu stress-induced void migration at narrow metal finger connected with wide line", Thin Solid Films, 516, 2007, pp. 449-453.
    • (2007) Thin Solid Films , vol.516 , pp. 449-453
    • Wang, R.C.J.1    Chang-Liao, K.S.2
  • 22
    • 84864975128 scopus 로고    scopus 로고
    • Morphological evolution of voids by surface drift diffusion driven by capillary, electromigration, and thermal-stress gradients induced by steady-state heat flow in passivated metallic thin films and flip chip solder joints. I. Theory
    • T. O. Ogurtani, O. Akyildiz.: "Morphological evolution of voids by surface drift diffusion driven by capillary, electromigration, and thermal-stress gradients induced by steady-state heat flow in passivated metallic thin films and flip chip solder joints. I. Theory, Journal of applied Physics 104, 023521, 2008.
    • (2008) Journal of Applied Physics , vol.104 , pp. 023521
    • Ogurtani, T.O.1    Akyildiz, O.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.