Electromigration testing of integrated circuit interconnections

Microelectronic Engineering

Volumn 40, Issue 3-4, 1998, Pages 207-221

  Fantini, F ^a   Lloyd, J R ^b   De Munari, I ^c   Scorzoni, A ^d  

^a UNIVERSITY OF MODENA AND REGGIO EMILIA   (Italy)

^b Lloyd Technology Associates Inc   (United States)

^c UNIVERSITY OF PARMA   (Italy)

^d CNR   (Italy)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTROMIGRATION; MICROSTRUCTURE; SEMICONDUCTOR DEVICE MODELS; SEMICONDUCTOR DEVICE TESTING; STATISTICAL METHODS;

ELECTROMIGRATION TESTING;

INTEGRATED CIRCUIT TESTING;

EID: 0032207675     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0167-9317(98)00272-X     Document Type: Article

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