Determination of migration effects in Cu-via structures with respect to process-induced stress

Microelectronics Reliability

Volumn 48, Issue 8-9, 2008, Pages 1393-1397

  Weide Zaage, Kirsten ^a   Zhao, Jiani ^a   Ciptokusumo, Joharsyah ^a   Aubel, Oliver ^b  

^a LEIBNIZ UNIVERSITY HANNOVER   (Germany)

^b AMD Saxony Limited Liability Company and Co KG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; FINITE ELEMENT METHOD;

COPPER METALLIZATION; FINITE ELEMENT SIMULATIONS; INDUCED STRESSES; INTERCONNECT STRUCTURES; MECHANICAL SIMULATIONS; MECHANICAL STRESSING; MIGRATION EFFECTS; PROCESS FLOWS; PROCESS TEMPERATURES; STRESS MIGRATION; STRESS-FREE TEMPERATURE; THERMOMIGRATION;

STRESSES;

EID: 50249128752     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2008.06.028     Document Type: Article

References (10)

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