Temperature-dependent stress-induced voiding in dual-damascene Cu interconnects

Microelectronics Reliability

Volumn 48, Issue 4, 2008, Pages 578-583

  Wu, ZhenYu ^a   Yang, YinTang ^a   Chai, ChangChun ^a   Li, YueJin ^a   Wang, JiaYou ^a   Liu, Jing ^a   Liu, Bin ^a  

^a BEIJING UNIVERSITY OF POSTS AND TELECOMMUNICATIONS   (China)

Author keywords

[No Author keywords available]

Indexed keywords

HIGH TEMPERATURE APPLICATIONS; MICROELECTRONICS; NUCLEATION; STRESS ANALYSIS;

HYDROSTATIC STRESS; NABARRO-HERRING EQUATIONS; STRESS MODELING;

INTERCONNECTION NETWORKS;

EID: 42649144738     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2007.12.001     Document Type: Article

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