Copper interconnect electromigration behavior in various structures and precise bimodal fitting

Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers

Volumn 45, Issue 2 A, 2006, Pages 700-709

  Lin, M H ^a,b   Lin, Y L ^a   Chang, K P ^a   Su, K C ^a   Wang, Tahui ^b  

^a UNITED MICROELECTRONICS CORPORATION   (Taiwan)

^b NATIONAL CHIAO TUNG UNIVERSITY   (Taiwan)

Author keywords

Bimodal; Copper; Electromigration; Low k; Weak link

Indexed keywords

COPPER; FAILURE ANALYSIS; MATHEMATICAL MODELS;

BIMODAL; LOW-K; WEAK LINK;

ELECTROMIGRATION;

EID: 32244435821     PISSN: 00214922     EISSN: None     Source Type: Journal    
DOI: 10.1143/JJAP.45.700     Document Type: Article

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