Structure-dependent behavior of stress-induced voiding in Cu interconnects

Thin Solid Films

Volumn 518, Issue 14, 2010, Pages 3778-3781

  Wu, Zhen Yu ^a   Yang, Yin Tang ^a   Chai, Chang Chun ^a   Li, Yue Jin ^a   Wang, Jia You ^a   Li, Bin ^a   Liu, Jing ^a  

^a BEIJING UNIVERSITY OF POSTS AND TELECOMMUNICATIONS   (China)

Author keywords

Interconnect; Reliability; Stress induced voiding

Indexed keywords

CU-INTERCONNECTS; INTERCONNECT RELIABILITY; INTERCONNECT STRUCTURES; SIMPLE MODEL; STRESS GRADIENT; STRESS MIGRATION; STRESS MODELING; STRESS-INDUCED VOIDING; TOP SURFACE;

QUALITY ASSURANCE; TENSILE STRESS;

FAILURE ANALYSIS;

EID: 77950540473     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2009.12.093     Document Type: Article

References (20)

1. Rosenberg R., Edelstein D.C., Hu C.K., and Rodbell K.P. Annu. Rev. Mater. Sci. 30 (2000) 229
2. Wang T.C., Hsieh T.E., Wang M.T., Su D.S., Chang C.H., Wang Y.L., and Lee J.Y.M. J. Electrochem. Soc. 152 (2005) G45
3. Weide-Zaage K., Dalleau D., Danto Y., and Fremont H. Microelectron. Reliab. 47 (2007) 319
4. Matsue T., Hanabusa T., Ikeuchi Y., Kusaka K., and Sakata O. Vacuum 80 (2006) 836
5. Li B.Z., Sullivan T.D., Lee T.C., and Badami D. Microelectron. Reliab. 44 (2004) 365
6. Shi L.T., and Tu K.N. Appl. Phys. Lett. 65 (1994) 1516
7. Aoyagi M. J. Vac. Sci. Technol., B 23 (2005) 2384
8. Wang R.C.J., Lee C.C., Chen L.D., Wu K., and Chang-Liao K.S. Microelectron. Reliab. 46 (2006) 1673
9. Shao W., Gan Z.H., Mhaisalkar S.G., Chen Z., and Li H. Thin Solid Films 504 (2006) 298
10. Gan Z.H., Shao W., Mhaisalkar S.G., Chen Z., and Li H. Thin Solid Films 504 (2006) 161
11. Rhee S.H., Du Y., and Ho P.S. J. Appl. Phys. 93 (2003) 3926
12. Paik J.M., Park H., and Joo Y.C. Microelectron. Eng. 71 (2004) 348
13. Ohring M. Materials Science of Thin Films. 2nd Ed. (2001), Academic Press
14. Sarychev M.E., V. Zhitnikov Yu., Borucki L., Liu C.-L., and Makhviladze T.M. Thin Solid Films 365 (2000) 211
15. Lloyd J.R., Lane M.W., Liniger E.G., Hu C.K., Shaw T.M., and Rosenberg R. IEEE Trans. Device Mater. Reliab. 5 (2005) 113
16. Lin M.H., Lin Y.L., Chang K.P., Su K.C., and Wang T. Microelectron. Reliab. 45 (2005) 1061
17. Vairagar A.V., Mhaisalkar S.G., and Krishnamoorthy A. Thin Solid Films 462-463 (2004) 325
18. Gambino J.P., Johnson C.L., Therrien J.E., Hunt D.B., Wynne J.E., Smith S., Mongeon S.A., Pokrinchak D.P., and Levin T.M. IEEE Trans. Device Mater. Reliab. 6 (2006) 197
19. Tu K.N., Mayer J.W., and Feldman L.C. Electronic Thin Film Sciences: for Electrical Engineers & Material Scientists (1997), Science Press, BeiJing
20. Nanao S., Kuribayashi K., Tanigawa S., Mor M., and Doyama M. J. Phys. F: Met. Phys. 3 (1973) L5