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Journal of the Electrochemical Society

Volumn 157, Issue 7, 2010, Pages

Effect of Cu-Ion concentration in concentrated H3 PO4 electrolyte on Cu electrochemical mechanical planarization

(5) Kung, Te Ming a Liu, Chuan Pu a Chang, Shih Chieh b Chen, Kei Wei b Wang, Ying Lang b

a NATIONAL CHENG KUNG UNIVERSITY (Taiwan)

b NATIONAL CHIAO TUNG UNIVERSITY (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

CU IONS; CU SURFACES; ELECTROCHEMICAL ANALYSIS; ELECTROCHEMICAL MECHANICAL PLANARIZATION; ELECTROLYTE SOLUTIONS; INTENSITY RATIO; ION CONCENTRATIONS; ION DIFFUSION; MICRO-SCALES; PASSIVE FILMS; PLANARIZATION EFFICIENCIES; REMOVAL RATE; X-RAY PHOTOELECTRON SPECTROSCOPY SPECTRA;

CONCENTRATION (PROCESS); ELECTROLYTES; HEAVY IONS; X RAY PHOTOELECTRON SPECTROSCOPY;

COPPER;

EID: 77953168671 PISSN: 00134651 EISSN: None Source Type: Journal
DOI: 10.1149/1.3425807 Document Type: Article

Times cited : (9)

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