Pattern effects on planarization efficiency of Cu electropolishing

Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers

Volumn 41, Issue 12, 2002, Pages 7332-7337

  Chang, Shih Chieh ^a   Shieh, Jia Min ^b   Huang, Chih Chang ^a   Dai, Bau Tong ^b   Feng, Ming Shiann ^a  

^a NATIONAL CHIAO TUNG UNIVERSITY   (Taiwan)

^b NATIONAL NANO DEVICE LABORATORIES   (Taiwan)

Author keywords

CMP; Cu; Electropolishing; Pattern; Phosphoric acid; Planarization

Indexed keywords

CHEMICAL MECHANICAL POLISHING; COPPER; PHOSPHORIC ACID;

PLANARIZATION EFFICIENCY (PE);

ELECTROLYTIC POLISHING;

EID: 0036997086     PISSN: 00214922     EISSN: None     Source Type: Journal    
DOI: 10.1143/jjap.41.7332     Document Type: Article

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