Electrolyte composition for Cu electrochemical mechanical planarization

Journal of the Electrochemical Society

Volumn 155, Issue 11, 2008, Pages

  Tripathi, Abhinav ^a   Burkhard, Craig ^b   Suni, Ian Ivar ^a   Li, Yuzhuo ^b   Doniat, Francois ^c   Barajas, Alex ^c   McAndrew, James ^c  

^a Clarkson University   (United States)

^b CLARKSON UNIVERSITY   (United States)

^c AIR LIQUIDE   (France)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER ALLOYS; DIELECTRIC MATERIALS; ELECTROCHEMICAL CORROSION; ELECTROCHEMICAL IMPEDANCE SPECTROSCOPY; ELECTROLYSIS; ELECTROLYTES; NANOTECHNOLOGY; OXIDE MINERALS; PAINTING; PASSIVATION; QUARTZ; QUARTZ CRYSTAL MICROBALANCES; SILICA; SILICATE MINERALS; SILICON COMPOUNDS;

ANODIC POTENTIALS; BENZOTRIAZOLE; CHEMICAL-MECHANICAL-PLANARIZATION; ELECTRO-CHEMICAL METHOD; ELECTROCHEMICAL MEASUREMENTS; ELECTROCHEMICAL MECHANICAL PLANARIZATION; ELECTROCHEMICAL QUARTZ CRYSTAL MICROBALANCE; ELECTROLYTE COMPOSITIONS; IN-SITU; INTERFACIAL IMPEDANCE; MECHANICAL FORCES; OXALIC ACIDS; PASSIVE FILMS; PATTERNED WAFERS; PLANARIZATION; PLANARIZATION EFFICIENCY; POROUS LOW-K; REMOVAL RATE; SILICA ABRASIVES; SURFACE ABRASION; SURFACE PASSIVATION;

COPPER;

EID: 52649155049     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.2980439     Document Type: Article

References (25)

1. N. Chandrashekaran, S. Ramarajan, W. Lee, G. M. Shabde, and S. Meikel, J. Electrochem. Soc., 151, G882 (2004).
2. I. I. Suni and B. Du, IEEE Trans. Semicond. Manuf., 18, 341 (2005).
3. P. B. Zantye, A. Kumar, and A. K. Sikder, Mater. Sci. Eng., R., 45, 89 (2004).
4. B. Du and I. I. Suni, J. Electrochem. Soc., 151, C375 (2004).
5. A. C. West, H. Deligianni, and P. C. Andricacos, IBM J. Res. Dev., 49, 37 (2005).
6. F. Q. Liu, T. Du, A. Duboust, S. Tsai, and W. Hsu, J. Electrochem. Soc., 153, C377 (2006).
7. Y. Oh, G. Park, and C. Chung, J. Electrochem. Soc., 153, G617 (2006).
8. S. Sato, Z. Yasuda, M. Ishihara, N. Komai, H. Ohttorii, A. Yoshio, Y. Segawa, H. Horikishi, Y. Ohoka, K. Tai, Tech. Dig.-Int. Electron Devices Meet., 2001, 4.4.1.
9. V. Brusic, M. A. Frisch, B. N. Eldridge, F. P. Kaufman, B. M. Rush, and G. S. Frankel, J. Electrochem. Soc., 138, 2253 (1991).
10. P. G. Fox, G. Lewis, and P. J. Boden, Corros. Sci., 19, 457 (1979).
11. A. Muthukumaran, V. Lowalekar, and S. Raghavan, Mater. Res. Soc. Symp. Proc., 914, 231 (2006).
12. F. Zucchi, G. Trabanelli, and M. Fonsati, Corros. Sci., 38, 2019 (1996).
13. D. P. Schweinsberg, S. E. Bottle, V. Otieno-Olego, and T. Notoya, J. Appl. Electrochem., 27, 161 (1997).
14. N. Huynh, S. E. Bottle, T. Notoya, and D. P. Schweinsberg, Corros. Sci., 42, 259 (2000).
15. D. Q. Zhang, L. X. Gao, and G. D. Zhou, Corros. Sci., 46, 3031 (2004).
16. D. Q. Zhang, L. X. Gao, and G. D. Zhou, Appl. Surf. Sci., 252, 4975 (2006).
17. S. K. Govindaswamy, A. Tripathi, I. I. Suni, and Y. Li, J. Electrochem. Soc., 155, H459 (2008).
18. J. Huo, R. Solanki, and J. A. McAndrew, J. Appl. Electrochem., 34, 305 (2004).
19. V. K. Gorantala, A. Babel, S. Pandija, and S. V. Babu, Electrochem. Solid-State Lett., 8, G131 (2005).
20. S. Aksu, J. Electrochem. Soc., 152, G938 (2005).
21. M. D. Ward and D. Buttry, Chem. Rev. (Washington, D.C.), 92, 1355 (1992).
22. D. Buttry, in Electroanalytical Chemistry. A Series of Advances, A. J. Bard, Editor, p. 29, Marcel Dekker, New York (1991).
23. M. R. Deakin and D. A. Buttry, Anal. Chem., 61, 1147A (1989).
24. Y. C. Wu, P. Zhang, H. W. Pickering, and D. L. Allara, J. Electrochem. Soc., 140, 2791 (1993).
25. D. Tromans and R. H. Sun, J. Electrochem. Soc., 138, 3235 (1991).