Investigation of galvanic corrosion between TaNx barriers and copper seed by electrochemical impedance spectroscopy

Electrochemical and Solid-State Letters

Volumn 10, Issue 10, 2007, Pages

  Hung, Chi Cheng ^a   Lee, Wen Hsi ^a   Wang, Yu Sheng ^a   Chang, Shih Chieh ^b   Wang, Ying Lang ^b,c  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

^b NATIONAL CHIAYI UNIVERSITY   (Taiwan)

^c NATIONAL UNIVERSITY OF TAINAN   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

CHARGE TRANSFER; COPPER; CORROSION INHIBITORS; ELECTROCHEMICAL IMPEDANCE SPECTROSCOPY; FLOW RATE; TANTALUM COMPOUNDS;

CHEMICAL-MECHANICAL-POLISHING SLURRY; ELECTROCHEMICAL SYSTEM; GALVANIC CORROSION; TANTALUM NITRIDE;

ELECTROCHEMICAL CORROSION;

EID: 34547841500     PISSN: 10990062     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.2756339     Document Type: Article

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