Mechanical strain evolution in Cu/low K interconnect lines

Materials Research Society Symposium - Proceedings

Volumn 795, Issue , 2003, Pages 3-8

  Besser, Paul R ^a   Jiang, Qing Ting ^b  

^a ADVANCED MICRO DEVICES   (United States)

^b SEMATECH   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTATIONAL COMPLEXITY; DIELECTRIC MATERIALS; ELECTROCHEMISTRY; FIBER OPTICS; INTEGRATED CIRCUITS; PERTURBATION TECHNIQUES; SILICON NITRIDE; STRESS ANALYSIS; THERMAL EXPANSION; X RAY DIFFRACTION;

COPPER LINES; ELECTRO-CHEMICAL DEPOSITION; FIBER OPTIC CAMERA; INTERCONNECTED LINES;

ELECTRIC LINES;

EID: 2442558130     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-795-u1.1     Document Type: Conference Paper

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