Surface Chemistry Studies of Copper Chemical Mechanical Planarization

Journal of the Electrochemical Society

Volumn 148, Issue 7, 2001, Pages

  Hernandez, J ^a,b   Wrschka, P ^a,c   Oehrlein, G S ^a,d,e  

^a STATE UNIVERSITY OF NEW YORK   (United States)

^b SpeedFam IPEC   (United States)

^c INFINEON TECHNOLOGIES   (United States)

^d UNIVERSITY OF MARYLAND   (United States)

^e ELECTROCHEMICAL SOCIETY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0013418486     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1377595     Document Type: Article

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