Anomalously high tensile creep rates from thin cast Sn3.9Ag0.6Cu lead-free solder

Journal of Electronic Materials

Volumn 34, Issue 7, 2005, Pages 1065-1075

  Xiao, Qiang ^a   Nguyen, Luu ^b   Armstrong, William D ^a  

^a UNIVERSITY OF WYOMING   (United States)

^b NATIONAL SEMICONDUCTOR CORPORATION   (United States)

Author keywords

Constitutive model; Creep; Lead free solder; Microstructural changes

Indexed keywords

ACTIVATION ENERGY; DATA REDUCTION; DIELECTRIC PROPERTIES; ERROR ANALYSIS; INTERMETALLICS; METALLOGRAPHY; MICROSTRUCTURE; SILVER; SOLDERING ALLOYS; TIN ALLOYS;

CONSTITUTIVE MODEL; CREEP RATES; LOAD-FREE SOLDER; MICROSTRUCTURAL CHANGES;

CREEP;

EID: 23244465886     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-005-0097-2     Document Type: Article

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