Etching of organic low dielectric constant material SiLKTM on the Lam Research Corporation 4520XLETM

Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films

Volumn 18, Issue 4 II, 2000, Pages 1859-1863

  Janowiak, C ^a   Ellingboe, S ^a   Morey, I ^a  

^a LAM RESEARCH CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DRY ETCHING; ETHYLENE; HYDROGEN; INTEGRATED CIRCUIT MANUFACTURE; OXYGEN; PERMITTIVITY; PHOTORESISTS; PLASMA APPLICATIONS; REDUCTION;

ETCH GAS;

DIELECTRIC MATERIALS;

EID: 0034224314     PISSN: 07342101     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.582436     Document Type: Article

References (9)

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