Stress, sheet resistance, and microstructure evolution of electroplated cu films during self-annealing

IEEE Transactions on Device and Materials Reliability

Volumn 10, Issue 1, 2010, Pages 47-54

  Huang, Rui ^a,b   Robl, Werner ^c   Ceric, Hajdin ^b   Detzel, Thomas ^c   Dehm, Gerhard ^d,e  

^a Kompetenzzentrum Automobil und Industrie Elektronik Gmbh   (Austria)

^b VIENNA UNIVERSITY OF TECHNOLOGY   (Austria)

^c INFINEON TECHNOLOGIES AG   (Germany)

^d UNIVERSITY OF LEOBEN   (Austria)

^e ERICH SCHMID INSTITUTE OF MATERIALS SCIENCE   (Austria)

Author keywords

Copper; Film stress; Microstructure; Selfannealing; Sheet resistance

Indexed keywords

COPPER FILMS; ELECTROPLATED COPPER FILM; ELECTROPLATED CU FILMS; FILM STRESS; MICROSTRUCTURE EVOLUTIONS; SELF-ANNEALING; SELF-ANNEALING EFFECTS; TIME DEPENDENCE;

ANNEALING; COPPER; COPPER PLATING; ELECTRIC RESISTANCE; METALLIC FILMS; MICROSTRUCTURE; SHEET RESISTANCE;

GRAIN GROWTH;

EID: 77949365678     PISSN: 15304388     EISSN: 15304388     Source Type: Journal    
DOI: 10.1109/TDMR.2009.2032768     Document Type: Article

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