Recrystallization of the copper films deposited by pulsed electroplating on ECR plasma-cleaned copper seed layers

Journal of the Korean Physical Society

Volumn 44, Issue 5 I, 2004, Pages 1108-1112

  Kwon, Dukryel ^a   Park, Hyunah ^a   Ghosh, S ^a   Lee, Chongmu ^a   Jeon, H T ^b   Lee, J G ^c  

^a Inha University   (South Korea)

^b Hanyang University   (South Korea)

^c Kookmin University   (South Korea)

Author keywords

Copper electroplating; EBSD; Post deposition annealing; XRD

Indexed keywords

EID: 2942637740     PISSN: 03744884     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Conference Paper

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