Characterization of electroplated copper films for three-dimensional advanced packaging

Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

Volumn 22, Issue 3, 2004, Pages 1108-1113

  Seah, C H ^a   You, G Z ^a   Li, C Y ^a   Kumar, R ^a  

^a INSTITUTE OF MICROELECTRONICS   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING; CHEMICAL VAPOR DEPOSITION; COPPER; DEPOSITION; ELECTROLYTES; ELECTROPLATING; POLISHING; SECONDARY ION MASS SPECTROMETRY;

CONFORMAL PLATING; COPPER FILMS; DIFFUSION BARRIERS; ELECTROPLATING PROCESS;

METALLIC FILMS;

EID: 3242682592     PISSN: 10711023     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.1755217     Document Type: Article

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