Two-step room temperature grain growth in electroplated copper

Journal of Applied Physics

Volumn 86, Issue 7, 1999, Pages 3642-3645

  Brongersma, S H ^a   Richard, E ^a   Vervoort, I ^a   Bender, H ^a   Vandervorst, W ^a   Lagrange, S ^a,b   Beyer, G ^a   Maex, K ^a,c  

^a IMEC   (Belgium)

^b Semitool Incorporated   (United States)

^c UNIVERSITY OF LEUVEN   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0001325323     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.371272     Document Type: Article

References (8)

1. M. Cook and T. L. Richards, J. Inst. Met. 70, 159 (1944).
2. C. C. Wong, H. I. Smith, and C. V. Thompson, Appl. Phys. Lett. 48, 335 (1985).
3. C. V. Thompson, J. Appl. Phys. 58, 763 (1985).
4. C. A. Handwerker and J. W. Cahn, Mater. Res. Soc. Symp. Proc. 106, 127 (1988).
5. P. A. Flinn, D. S. Gardner, and W. D. Nix, IEEE Trans. Electron Devices 34, 689 (1987).
6. J. E. Palmer, C. V. Thompson, and H. I. Smith, J. Appl. Phys. 62, 2492 (1987).
7. L. H. Chou, Appl. Phys. Lett. 58, 2631 (1991).
8. C. V. Thompson, Mater. Res. Soc. Symp. Proc. 106, 115 (1988).