Last metal copper metallization for power devices

IEEE Transactions on Semiconductor Manufacturing

Volumn 21, Issue 3, 2008, Pages 358-362

  Robi, Werner ^a   Melzl, Michael ^a   Weidgans, Berngard ^a   Hofmann, Renate ^a   Stecher, Matthias ^a  

^a INFINEON TECHNOLOGIES AG   (Germany)

Author keywords

Copper; Electroless plating; Electroplating; Texture

Indexed keywords

ALUMINA; CHEMICAL ENGINEERING; CLADDING (COATING); COPPER; ELECTRIC EQUIPMENT; ELECTROLESS PLATING; GOLD; LIGHT METALS; METALS; ORES; PALLADIUM; WIRE;

BOND INTERFACE; COPPER WIRES; CU LAYERS; ELECTROLESS COATINGS; ELECTROPLATING; HIGH CURRENTS; HIGH RELIABLE; HOMOGENEOUS THICKNESS DISTRIBUTION; KEY PARAMETERS; LOW RESISTIVITY; METAL COPPER; PATTERN PLATING; PLATING PROCESSES; POWER DEVICES; TEXTURE;

COPPER SMELTING;

EID: 49249098290     PISSN: 08946507     EISSN: None     Source Type: Journal    
DOI: 10.1109/TSM.2008.2001210     Document Type: Conference Paper

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