Recrystallization effects in Cu electrodeposits used in fine line damascene structures

Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

Volumn 19, Issue 3, 2001, Pages 762-766

  Jiang, Qing Tang ^b   Thomas, Michael E ^a  

^a HONEYWELL   (United States)

^b NONE

Author keywords

[No Author keywords available]

Indexed keywords

ELECTROPLATING; GRAIN GROWTH; METALLIC FILMS; METALLOGRAPHIC MICROSTRUCTURE; RECRYSTALLIZATION (METALLURGY);

DAMASCENE STRUCTURES;

COPPER;

EID: 0035326479     PISSN: 10711023     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.1366708     Document Type: Conference Paper

References (9)

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