Roomerature microstructural evolution of electroplated Cu studied by focused ion beam and positron annihilation lifetime spectroscopy

Journal of Applied Physics

Volumn 103, Issue 6, 2008, Pages

  Yin, K B ^a   Xia, Y D ^a   Zhang, W Q ^a   Wang, Q J ^a   Zhao, X N ^a   Li, A D ^a   Liu, Z G ^a   Hao, X P ^b   Wei, L ^b   Chan, C Y ^c   Cheung, K L ^c   Bayes, M W ^c   Yee, K W ^c  

^a NANJING UNIVERSITY   (China)

^b INSTITUTE OF HIGH ENERGY PHYSICS   (China)

^c Rohm and Haas Electronic Materials Asia Limited   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; ELECTROPLATED PRODUCTS; FOCUSED ION BEAMS; GRAIN GROWTH; POSITRON ANNIHILATION SPECTROSCOPY; VACANCIES;

INCUBATION TIME; VACANCY CLUSTERS; VACANCY-TYPE DEFECTS;

MICROSTRUCTURAL EVOLUTION;

EID: 41549145814     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2874497     Document Type: Article

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