-
1
-
-
66449119228
-
-
available from
-
ITRS Roadmap available from http://www.itrs.net/.
-
ITRS Roadmap
-
-
-
2
-
-
0029489783
-
Embedded micromechanical devices for the monolithic integration of MEMS with CMOS
-
J. H. Smith, S. Montague, J. J. Sniegowski, J. R. Murray, P. J. McWhorter, "Embedded Micromechanical Devices for the Monolithic Integration of MEMS with CMOS", IEDM Technical Digest, pp. 609-612, 1995.
-
(1995)
IEDM Technical Digest
, pp. 609-612
-
-
Smith, J.H.1
Montague, S.2
Sniegowski, J.J.3
Murray, J.R.4
McWhorter, P.J.5
-
3
-
-
0036120449
-
CMOS MEMS - Present and future
-
Technical Digest
-
H. Baltes, O. Brand, A. Hierlemann, D. Lange, C. Hagleitner, "CMOS MEMS - Present and Future", Technical Digest, Fifteenth IEEE International Conference on Micro Electro Mechanical Systems, pp. 459-466, 2002.
-
(2002)
Fifteenth IEEE International Conference on Micro Electro Mechanical Systems
, pp. 459-466
-
-
Baltes, H.1
Brand, O.2
Hierlemann, A.3
Lange, D.4
Hagleitner, C.5
-
4
-
-
34248138498
-
Adding functionality to microchips by wafer post-processing
-
11 June
-
J. Schmitz, "Adding functionality to microchips by wafer post-processing", Nuclear Instruments and Methods in Physics Research A, Volume 576, no 1, 11 June 2007, pp 142-149.
-
(2007)
Nuclear Instruments and Methods in Physics Research A
, vol.576
, Issue.1
, pp. 142-149
-
-
Schmitz, J.1
-
5
-
-
0042284294
-
Full integration of a pressure-sensor system into a standard BiCMOS process
-
May, 3
-
T. Scheiter, H. Kapels, K.-G. Oppermann, M. Steger, C. Hierold, W.M. Werner and H.-J. Timme, "Full integration of a pressure-sensor system into a standard BiCMOS process", Sensors and Actuators A: Physical, Vol. 67, Issues 1-3, pp. 211-214, May 1998.
-
(1998)
Sensors and Actuators A: Physical
, vol.67
, Issue.S 1
, pp. 211-214
-
-
Scheiter, T.1
Kapels, H.2
Oppermann, K.-G.3
Steger, M.4
Hierold, C.5
Werner, W.M.6
Timme, H.-J.7
-
6
-
-
27644570826
-
Design and fabrication of the SCUBA- 2 detector for the JCM telescope
-
London, 25 April
-
W. Parkes, C.C. Dunare, A.J. Walton, J.G. Terry, J.T.M. Stevenson, A.S. Bunting, A.M. Gundlach, S. Smith, G.C. Hilton, K.D. Irwin, J.N. Ullom, W.D. Duncan, W.S. Holland, M.D. Audley, M.J. MacIntosh, M. Ellis, P.A.R. Ade, R. Sudiwala and E. Schulte, "Design and fabrication of the SCUBA- 2 detector for the JCM telescope", IEE Seminar on MEMS Sensor Technologies, London, 25 April 2005, 8/1-8/5.
-
(2005)
IEE Seminar on MEMS Sensor Technologies
-
-
Parkes, W.1
Dunare, C.C.2
Walton, A.J.3
Terry, J.G.4
Stevenson, J.T.M.5
Bunting, A.S.6
Gundlach, A.M.7
Smith, S.8
Hilton, G.C.9
Irwin, K.D.10
Ullom, J.N.11
Duncan, W.D.12
Holland, W.S.13
Audley, M.D.14
MacIntosh, M.J.15
Ellis, M.16
Ade, P.A.R.17
Sudiwala, R.18
Schulte, E.19
-
7
-
-
33749536255
-
Test structures for the characterisation of MEMS and CMOS integration technology
-
6-9th March
-
H. Lin, A.J. Walton, C.C. Dunare, J.T.M. Stevenson, A.M. Gundlach, S. Smith, A.S. Bunting; "Test Structures for the Characterisation of MEMS and CMOS Integration Technology", IEEE International Conference on Microelectronic Test Structures, pp. 143-148, 6-9th March 2006.
-
(2006)
IEEE International Conference on Microelectronic Test Structures
, pp. 143-148
-
-
Lin, H.1
Walton, A.J.2
Dunare, C.C.3
Stevenson, J.T.M.4
Gundlach, A.M.5
Smith, S.6
Bunting, A.S.7
-
8
-
-
33749526996
-
Application of CMP for integrating MEMS and CMOS technology
-
H. Lin, J.T.M. Stevenson, A.M. Gundlach, C.C. Dunare, A.J. Walton, "Application of CMP for Integrating MEMS and CMOS Technology", 16th European Workshop on MicroMechanics (MME), pp. 207-210, 2005.
-
(2005)
16th European Workshop on MicroMechanics (MME)
, pp. 207-210
-
-
Lin, H.1
Stevenson, J.T.M.2
Gundlach, A.M.3
Dunare, C.C.4
Walton, A.J.5
-
9
-
-
33847028640
-
Microsensor integration into systemson-chip
-
O. Brand, "Microsensor Integration into Systemson- Chip", Proceedings of the IEEE, 94, no.6, pp. 1160-1176, 2006.
-
(2006)
Proceedings of the IEEE
, vol.94
, Issue.6
, pp. 1160-1176
-
-
Brand, O.1
-
10
-
-
0032635182
-
Post-CMOS integration of germanium microstructures
-
Orlando, FL, USA
-
A.E. Franke, D. Bilic, D.T.Chang, P.T. Jones, T.-J. King, R.T. Howe, G.C. Johnson, "Post-CMOS integration of germanium microstructures", Twelfth IEEE International Conference on Micro Electro Mechanical Systems, 1999. MEMS '99, Orlando, FL, USA. pp 630-637, Jan 1999
-
Twelfth IEEE International Conference on Micro Electro Mechanical Systems 1999. MEMS '99
, pp. 630-637
-
-
Franke, A.E.1
Bilic, D.2
Chang, D.T.3
Jones, P.T.4
King, T.-J.5
Howe, R.T.6
Johnson, G.C.7
-
11
-
-
33645704796
-
Low-temperature LPCVD of polycrystalline GexSi1-x films with high germanium content
-
A. Kovalgin, J, Holleman, "Low-Temperature LPCVD of Polycrystalline GexSi1-x Films with High Germanium Content", Journal of The Electrochemical Society, vol 153, pp G363-G371, 2006.
-
(2006)
Journal of the Electrochemical Society
, vol.153
-
-
Kovalgin, A.1
Holleman, J.2
-
12
-
-
0033307876
-
A review of the history and technology of micromachined miniature displays using foundry produced silicon backplanes
-
27-29th October
-
A.J. Walton, D.G. Vass, I. Underwood, G. Bodammer, D.W. Calton, K. Seunarine, J.T.M. Stevenson, A.M. Gundlach; "A Review of the History and Technology of Micromachined Miniature Displays Using Foundry Produced Silicon Backplanes", SPIE Design, Characterisation, and Packaging for MEMS and Microelectronics, 3893, pp. 26-38, 27-29th October 1999.
-
(1999)
SPIE Design, Characterisation, and Packaging for MEMS and Microelectronics
, vol.3893
, pp. 26-38
-
-
Walton, A.J.1
Vass, D.G.2
Underwood, I.3
Bodammer, G.4
Calton, D.W.5
Seunarine, K.6
Stevenson, J.T.M.7
Gundlach, A.M.8
-
13
-
-
33144475423
-
Microlens design for CMOS image sensor
-
Optical Design and Engineering II
-
C. Fossatil, O. Gaglianol, M. Commandrel, B. Dunne, "Microlens design for CMOS image sensor", Proc. SPIE vol. 5962, Optical Design and Engineering II pp. 696-703, 2005.
-
(2005)
Proc. SPIE
, vol.5962
, pp. 696-703
-
-
Fossatil, C.1
Gaglianol, O.2
Commandrel, M.3
Dunne, B.4
-
14
-
-
2342597842
-
Light-emitting polymer on CMOS: A new photonic technology?
-
Edited by Ambs, Pierre; Beyette, Fred R., Jr. Proceedings of the SPIE
-
I. Underwood, J. Gourlay, "Light-emitting polymer on CMOS: a new photonic technology?", Wave Optics and Photonic Devices for Optical Information Processing II. Edited by Ambs, Pierre; Beyette, Fred R., Jr. Proceedings of the SPIE, Volume 5181, pp. 110-119, 2003.
-
(2003)
Wave Optics and Photonic Devices for Optical Information Processing II
, vol.5181
, pp. 110-119
-
-
Underwood, I.1
Gourlay, J.2
-
15
-
-
84943201512
-
A miniaturized multiwire proportional chamber using CMOS wafer scale post-processing
-
V. M. Blanco Carballo, M. Chefdeville, H. van der Graaf, C. Salm, A. A. I. Aarnink, S. M. Smits, D. M. Altpeter, J. Timmermans, J. L. Visschers, J. Schmitz, "A miniaturized multiwire proportional chamber using CMOS wafer scale post-processing", ESSDERC, pp 129-132, 2006.
-
(2006)
ESSDERC
, pp. 129-132
-
-
Blanco Carballo, V.M.1
Chefdeville, M.2
Van Der Graaf, H.3
Salm, C.4
Aarnink, A.A.I.5
Smits, S.M.6
Altpeter, D.M.7
Timmermans, J.8
Visschers, J.L.9
Schmitz, J.10
-
16
-
-
67649964416
-
Building EWOD microfluidic array technology on top of foundry CMOS
-
27-28 April
-
Y. Li, P. Li, A Kazantzis, L.I. Haworth, A W S Ross, J G Terry, J T M Stevenson, A M Gundlach, A. Bunting, A.J. Walton; "Building EWOD microfluidic array technology on top of foundry CMOS", IET Seminar on MEMS Sensors and Actuators, pp. 25-30, 27-28 April 2006.
-
(2006)
IET Seminar on MEMS Sensors and Actuators
, pp. 25-30
-
-
Li, Y.1
Li, P.2
Kazantzis, A.3
Haworth, L.I.4
Ross, A.W.S.5
Terry, J.G.6
Stevenson, J.T.M.7
Gundlach, A.M.8
Bunting, A.9
Walton, A.J.10
-
17
-
-
0032140199
-
A MEMS-based projection display
-
Aug.
-
F. van Kessel, L.J. Hombeck, R.E. Meier, M.R. Douglass, "A MEMS-based projection display", Proc. IEEE 86, no 8, Aug, 1998, pp 1687-1704.
-
(1998)
Proc. IEEE
, vol.86
, Issue.8
, pp. 1687-1704
-
-
Van Kessel, F.1
Hombeck, L.J.2
Meier, R.E.3
Douglass, M.R.4
-
18
-
-
17644440273
-
8 IMEMS inertial measurement unit components
-
39.1.1-39.1.4
-
8 IMEMS Inertial Measurement Unit Components", IEDM, pp 39.1.1-39.1.4, 2003.
-
(2003)
IEDM
-
-
Lewis, S.1
Alie, S.2
Brosnihan, T.3
Core, C.4
Core, T.5
Howe, R.6
Geen, J.7
Hollocher, D.8
Judy, M.9
Memishian, J.10
Nunan, K.11
Paine, R.12
Sherman, S.13
Tsang, B.14
Wachtmann, B.15
-
19
-
-
77949305517
-
Integrated MEMS sensors for industrial control
-
Jan
-
B. Scannell, "Integrated MEMS Sensors for Industrial Control", EPN, Jan 2007.
-
(2007)
EPN
-
-
Scannell, B.1
-
20
-
-
0034250942
-
Laminated, sacrificial-poly MEMS technology in standard CMOS
-
D.F. Guillou, S. Santhanam, L. R. Carley, "Laminated, Sacrificial-poly MEMS Technology in Standard CMOS", Sensors and Actuators A (Physical), 85, pp. 346-355, 2000.
-
(2000)
Sensors and Actuators A (Physical)
, vol.85
, pp. 346-355
-
-
Guillou, D.F.1
Santhanam, S.2
Carley, L.R.3
-
21
-
-
0036150571
-
Fabrication of diffractive optical elements using the CMOS process
-
C-L. Dai, H-L. Chen, C-Y. Lee, P.-Z. Chang, "Fabrication of diffractive optical elements using the CMOS process", J. Micromech. Microeng. Vol 12 pp 21-25, 2002.
-
(2002)
J. Micromech. Microeng.
, vol.12
, pp. 21-25
-
-
Dai, C.-L.1
Chen, H.-L.2
Lee, C.-Y.3
Chang, P.-Z.4
-
22
-
-
0036540106
-
Post-CMOS processing for high-aspectratio integrated silicon microstructures
-
X. Huikai Xie, L. Erdmann, Z. Xu, K, Gabriel, G.K. Fedder, "Post-CMOS processing for high-aspectratio integrated silicon microstructures", Journal of Microelectromechanical Systems, Vol 11, No 2, pp 93-101, April 2002.
-
(2002)
Journal of Microelectromechanical Systems
, vol.11
, Issue.2
, pp. 93-101
-
-
Huikai Xie, X.1
Erdmann, L.2
Xu, Z.3
Gabriel, K.4
Fedder, G.K.5
-
23
-
-
0036601235
-
Post-CMOS micromachined lateral accelerometer
-
June
-
H. Luo, G. Zhang, L.R. Carley, G.K. Fedder, "Post- CMOS Micromachined Lateral Accelerometer", Journal MicroElectromechanical Systems, pp188-195, Vol.11, No.3, June 2002.
-
(2002)
Journal MicroElectromechanical Systems
, vol.11
, Issue.3
, pp. 188-195
-
-
Luo, H.1
Zhang, G.2
Carley, L.R.3
Fedder, G.K.4
-
24
-
-
0006271005
-
Copper interconnect low-k dielectric post-CMOS micromachining
-
X. Zhu, S. Santhanpn, H. Lakdawala, H. Luo, G.K. Fedder., "Copper interconnect low-k dielectric post-CMOS Micromachining", Transducers 2001 Digest of Technical Papers, pp. 1548-1551, 2001.
-
(2001)
Transducers 2001 Digest of Technical Papers
, pp. 1548-1551
-
-
Zhu, X.1
Santhanpn, S.2
Lakdawala, H.3
Luo, H.4
Fedder, G.K.5
-
25
-
-
1542344195
-
Toward a miniature wireless integrated multisensor microsystem for industrial and biomedical applications
-
T.B. Tang, E.A. Johannessen, L. Wang, A. Astaras, M. Ahmadian, A.F. Murray, J.M. Cooper, S.P. Beaumont, B.W. Flynn, D.R.S. Cumming; "Toward A Miniature Wireless Integrated Multisensor Microsystem for Industrial and Biomedical Applications", IEEE Sensors Journal: Special Issue on Integrated Multisensor Systems and Signal Processing, 2, 6, 628-635, 2002.
-
(2002)
IEEE Sensors Journal: Special Issue on Integrated Multisensor Systems and Signal Processing
, vol.2
, Issue.6
, pp. 628-635
-
-
Tang, T.B.1
Johannessen, E.A.2
Wang, L.3
Astaras, A.4
Ahmadian, M.5
Murray, A.F.6
Cooper, J.M.7
Beaumont, S.P.8
Flynn, B.W.9
Cumming, D.R.S.10
-
26
-
-
1542271652
-
A single-chip pH sensor fabricated by a conventional CMOS process
-
P.A. Hammond, D.R.S. Cumming, D. Ali, "A single-chip pH sensor fabricated by a conventional CMOS process", Proceedings of IEEE Sensors. Vol 1, pp 350-355, 2002.
-
(2002)
Proceedings of IEEE Sensors
, vol.1
, pp. 350-355
-
-
Hammond, P.A.1
Cumming, D.R.S.2
Ali, D.3
-
27
-
-
84990385560
-
Prototype detector technology for the SCUBA-2 sub-millimetre bolometer array
-
A.J. Walton, W. Parkes, J.G. Terry, C.C. Dunare, J.T.M. Stevenson, A.M. Gundlach, S. Smith, G.C. Hilton, K.D. Irwin, J.N. Ullom, W.D. Duncan, W.S. Holland, M.D. Audley, H. McGregor, P.A.R. Ade, R.V. Sudiwala, A.L. Woodcraft, E. Schulte; "Prototype Detector Technology for the SCUBA-2 Sub-millimetre Bolometer Array", Journal of Nanoengineering and Nanosystems: Proc IMecE Part N, 219, pp. 11-21, 2005.
-
(2005)
Journal of Nanoengineering and Nanosystems: Proc IMecE Part N
, vol.219
, pp. 11-21
-
-
Walton, A.J.1
Parkes, W.2
Terry, J.G.3
Dunare, C.C.4
Stevenson, J.T.M.5
Gundlach, A.M.6
Smith, S.7
Hilton, G.C.8
Irwin, K.D.9
Ullom, J.N.10
Duncan, W.D.11
Holland, W.S.12
Audley, M.D.13
McGregor, H.14
Ade, P.A.R.15
Sudiwala, R.V.16
Woodcraft, A.L.17
Schulte, E.18
-
28
-
-
33747321428
-
A design study of microscale magnetic components for operation in the MHz frequency range
-
D Flynn, R S Dhariwal and M P Y Desmulliez, "A design study of microscale magnetic components for operation in the MHz frequency range", J. Micromech. Microeng. Vol 16, 2006, pp 1811-1818.
-
(2006)
J. Micromech. Microeng.
, vol.16
, pp. 1811-1181
-
-
Flynn, D.1
Dhariwal, R.S.2
Desmulliez, M.P.Y.3
-
29
-
-
0034998405
-
High performance accelerometer based on CMOS technologies with low cost add-ons
-
M. Brandl, V. Kempe, "High performance accelerometer based on CMOS technologies with low cost add-ons", Proc .IEEE MEMS 2001, pp. 6-9, 2001
-
(2001)
Proc. IEEE MEMS 2001
, pp. 6-9
-
-
Brandl, M.1
Kempe, V.2
-
30
-
-
20244380780
-
Detection of single electrons by means of a Micromegas-covered MediPix2 pixel CMOS readout circuit
-
DOI 10.1016/j.nima.2004.11.036, PII S0168900204024428
-
M. Campbell, M. Chefdeville, P. Colas, A.P. Colijn, A. Fornaini, Y. Giomataris, H. van der Graaf, E.H.M. Heijne, P. Kluit, X. Llopart, J. Schmitz, J. Timmermans, J.L. Visschers, "Detection of single electrons by means of a Micromegas coveredMediPix2 pixel CMOS readout circuit", Nuclear Instruments and Methods in Physics Research A, vol 540pp 295-304, 2005. (Pubitemid 40583797)
-
(2005)
Nuclear Instruments and Methods in Physics Research, Section A: Accelerators, Spectrometers, Detectors and Associated Equipment
, vol.540
, Issue.2-3
, pp. 295-304
-
-
Campbell, M.1
Chefdeville, M.2
Colas, P.3
Colijn, A.P.4
Fornaini, A.5
Giomataris, Y.6
Van Der Graaf, H.7
Heijne, E.H.M.8
Kluit, P.9
Llopart, X.10
Schmitz, J.11
Timmermans, J.12
Visschers, J.L.13
-
31
-
-
84961736622
-
A wafer-scale 3D IC technology platform using dielectric bonding glues and copper damascene patterned inter-wafer interconnect
-
J-Q Lu, Y. Kwon, G. Rajagopalan, M. Gupta, J. McMahon, K-W. Lee, R.P. Kraft, J.F. McDonald, T.S. Cale, R.J. Gutmann, B. Xu, E. Eisenbraun, J. Castracane, A. Kaloyeros, "A wafer-scale 3D IC technology platform using dielectric bonding glues and copper damascene patterned inter-wafer interconnect", Proceedings of the IEEE 2002 International Interconnect Technology Conference, pp 78-80, 2002.
-
(2002)
Proceedings of the IEEE 2002 International Interconnect Technology Conference
, pp. 78-80
-
-
Lu, J.-Q.1
Kwon, Y.2
Rajagopalan, G.3
Gupta, M.4
McMahon, J.5
Lee, K.-W.6
Kraft, R.P.7
McDonald, J.F.8
Cale, T.S.9
Gutmann, R.J.10
Xu, B.11
Eisenbraun, E.12
Castracane, J.13
Kaloyeros, A.14
-
32
-
-
33847328761
-
Through-wafer interconnection by deep damascene process for MEMS and 3D wafer level packaging
-
7-9 Dec.
-
N. Ranganathan, N. Jiang, E. Liao, C.S. Premachandran, K. Prasad, N. Balasubramanian, "Through-wafer interconnection by deep damascene process for MEMS and 3D wafer level packaging", Proceedings of 7th Electronic Packaging Technology Conference, 2005. EPTC 2005, 5pp, 7-9 Dec. 2005.
-
(2005)
Proceedings of 7th Electronic Packaging Technology Conference, 2005. EPTC 2005
-
-
Ranganathan, N.1
Jiang, N.2
Liao, E.3
Premachandran, C.S.4
Prasad, K.5
Balasubramanian, N.6
|