Prototype detector technology for the SCUBA-2 submillimetre bolometer array

Proceedings of the Institution of Mechanical Engineers, Part N: Journal of Nanoengineering and Nanosystems

Volumn 219, Issue 1, 2005, Pages 11-21

  Walton, A J ^a   Parkes, W ^a   Terry, J G ^a   Dunare, C ^a   Stevenson, J T M ^a   Gundlach, A M ^a   Bunting, A ^a   Smith, S ^a   Hilton, G C ^b   Irwin, K D ^b   Ullom, J N ^b   Duncan, W D ^b   Holland, W S ^c   Audley, M D ^c   Mcgregor, H ^c   Ade, P A R ^d   Sudiwala, R V ^d   Woodcraft, A L ^d   Schulte, E ^e  

^a UNIVERSITY OF EDINBURGH   (United Kingdom)

^b NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY   (United States)

^c UK ASTRONOMY TECHNOLOGY CENTRE   (United Kingdom)

^d UNIVERSITY OF WALES   (United Kingdom)

^e RAYTHEON COMPANY   (United States)

Author keywords

deep RIE; indium bump bonding; membrane; MEMS; micromachining; silicon; Submillimetre wavelengths; transition edge sensor; wafer bonding; Wafer grinding

Indexed keywords

EID: 84990385560     PISSN: 17403499     EISSN: 20413092     Source Type: Journal    
DOI: 10.1243/174034905X77337     Document Type: Article

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