Ambient copper-copper thermocompression bonding using self-assembled monolayers

Materials Research Society Symposium Proceedings

Volumn 1112, Issue , 2009, Pages 91-99

  Ang, Xiao F ^a   Wei, J ^b   Chen, Z ^a   Wong, Chee C ^a  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^b SINGAPORE INSTITUTE OF MANUFACTURING TECHNOLOGY   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

A-THERMAL; AMBIENT CONDITIONS; AMBIENT TEMPERATURES; BOND FORMATION; BOND STRENGTH; BONDING INTERFACES; BONDING TEMPERATURES; BULK OXIDES; COPPER ATOMS; COPPER SURFACE; JOINT STRENGTH; MECHANICAL DEFORMATION; ORGANIC MONOLAYERS; PHYSICAL CONTACTS; ROOM TEMPERATURE; TEMPERATURE DEPENDENCE; THERMAL DEPENDENCES; THERMO COMPRESSION BONDING; THERMO-COMPRESSION; ULTRA-CLEAN ENVIRONMENT; ULTRA-THIN;

COPPER; COPPER OXIDES; ELECTRON ENERGY LEVELS; OXIDATION; SELF ASSEMBLED MONOLAYERS; SURFACE CHEMISTRY; THREE DIMENSIONAL; ULTRAHIGH VACUUM;

SURFACES;

EID: 70449638226     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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