Application of contact theory to metal-metal bonding of silicon wafers

Journal of Applied Physics

Volumn 102, Issue 10, 2007, Pages

  Leong, H L ^b   Gan, C L ^a   Thompson, C V ^b,c   Pey, K L ^b,d   Li, H Y ^e  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^b SINGAPORE MIT ALLIANCE   (Singapore)

^c Massachusetts Institute of Technology Cambridge   (United States)

^d NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^e INSTITUTE OF MICROELECTRONICS   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

ATOMIC FORCE MICROSCOPY; COPPER; SURFACE ROUGHNESS;

BOND INTEGRITY; CONTACT THEORY; METAL-METAL BONDING; THERMOCOMPRESSION BONDS;

SILICON WAFERS;

EID: 36649036367     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2811724     Document Type: Article

References (31)

1. K. Banerjee, S. J. Souri, P. Kapur, and K. C. Saraswat, Proc. IEEE 89, 602 (2001).
2. C. H. Tsau, Ph.D. thesis, MIT, 2003.
3. K. N. Chen, A. Fan, C. S. Tan, and R. Reif, J. Electron. Mater. 35, 230 (2006).
4. K. N. Chen, C. S. Tan, A. Fan, and R. Reif, J. Electron. Mater. 34, 1646 (2005).
5. A. Fan, A. Rahman, and R. Reif, Electrochem. Solid-State Lett. 2, 534 (1999).
6. K. N. Chen, A. Fan, and R. Reif, J. Electron. Mater. 30, 331 (2001).
7. K. N. Chen, A. Fan, and R. Reif, Electrochem. Solid-State Lett. 7, G14 (2004).
8. K. N. Chen, A. Fan, and R. Reif, J. Mater. Sci. 37, 3441 (2002).
9. K. N. Chen, IEEE Electron Device Lett. 25, 10 (2004).
10. K. N. Chen, A. Fan, C. S. Tan, and R. Reif, Appl. Phys. Lett. 86, 011903 (2005).
11. K. N. Chen, IEEE International Electron Devices Meeting (2006).
12. B. Swinnen, IEEE International Electron Devices Meeting (2006).
13. J. A. Greenwood and B. J. P. Williamson, Proc. R. Soc. London, Ser. A 295, 300 (1966).
14. H. Hertz, J. Reine Angew. Math. 92, 156 (1881); Hertz's Miscellaneous Paper (Macmillan, London, 1986), Chap..
15. H. Hertz, J. Reine Angew. Math. 92, 156 (1881); Hertz's Miscellaneous Paper (Macmillan, London, 1986), Chap..
16. W. R. Chang, I. Etsion, and D. B. Bogy, J. Tribol. 109, 257 (1987).
17. K. Willner, Computational Methods in Contact Mechanics III, Transaction: Engineering Sciences, edited by, A. Samartin, and, M. H. Aliabadi, Vol. 14, p. 13 (1997).
18. Y. Zhao, D. M. Maietta, and L. Chang, J. Tribol. 122, 86 (2000).
19. L. Kogut and I. Etsion, J. Appl. Mech. 69, 657 (2002).
20. R. L. Jackson and I. Green, Tribol. Int. 39, 906 (2006).
21. D. Tabor, Proc. R. Soc. London, Ser. A 192, 247 (1948).
22. P. R. Nayak, ASME J. Lubr. Technol. 93, 398 (1971).
23. D. Tabor, The Hardness of Metals (Clarendon, Oxford, 1951).
24. J. S. Field and M. V. Swain, J. Mater. Res. 8, 297 (1993).
25. A. I. Nadai, Theory of Flow and Fracture of Solids (McCraw-Hill, New York, 1963), Vol. 2, p. 221.
26. J. I. McCool, Wear 107, 37 (1986).
27. M. Abramowitz and I. A. Stegun, Handbook of Mathematical Functions (U.S. Department of Commerce, Springfield, VA, 1964), Vol. 55.
28. K. L. Chavez and D. W. Hess, J. Electrochem. Soc. 148, G640 (2001).
29. R.-M. Keller, P. S. Baker, and E. Arzt, J. Mater. Sci. 13, 1307 (1998).
30. D. Jia, K. T. Ramesh, E. Ma, L. Lu, and K. Lu, Scr. Mater. 45, 613 (2001).
31. H. L. Leong, Quantitative Analysis of the Mechanical and Electrical Properties of Cu-Cu Bonds for Three-Dimensional Integrated Circuits (3D ICs), PhD Thesis, Nanyang Technological University, 2007.