Thermal Management of Vertically Integrated Packages

Handbook of 3D Integration: Technology and Applications of 3D Integrated Circuits

Volumn 2, Issue , 2008, Pages 635-649

  Brunschwiler, Thomas ^a   Michel, Bruno ^a  

^a IBM RESEARCH ZURICH   (Switzerland)

Author keywords

Conduction; Convection; Heat transfer; Interlayer cooling; Microchannel; Thermal management; Thermal vias

Indexed keywords

EID: 70449637149     PISSN: None     EISSN: None     Source Type: Book    
DOI: 10.1002/9783527623051.ch33     Document Type: Chapter

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