Thermomechanical properties of aluminum alkoxide (alucone) films created using molecular layer deposition

Acta Materialia

Volumn 57, Issue 17, 2009, Pages 5083-5092

  Miller, David C ^a,b   Foster, Ross R ^a,b   Jen, Shih Hui ^b   Bertrand, Jacob A ^b   Seghete, Dragos ^b   Yoon, Byunghoon ^b   Lee, Yung Cheng ^a,b   George, Steven M ^b   Dunn, Martin L ^a,b  

^a UCB 450   (United States)

^b UNIVERSITY OF COLORADO   (United States)

Author keywords

Durability; Mechanical properties; Reliability; Robustness; Thin film

Indexed keywords

ALUMINA FILMS; ALUMINUM ALKOXIDES; AMBIENT ENVIRONMENT; ATOMIC LAYER; CHANGE IN THICKNESS; COEFFICIENT OF THERMAL EXPANSION; ENVIRONMENTAL INFLUENCES; FILM STRESS; INDENTATION MEASUREMENTS; MICROCANTILEVER BEAMS; MOLECULAR LAYER DEPOSITION; NANO-METER-SCALE; ROBUSTNESS; TEMPORAL BEHAVIOR; THERMAL CYCLE; THERMOMECHANICAL PROPERTIES; WAFER CURVATURE METHODS;

ALUMINA; ALUMINUM; CHEMICAL STABILITY; DURABILITY; MECHANICAL PROPERTIES; PLASTIC COATINGS; SELF ASSEMBLY; THIN FILM DEVICES; THIN FILMS;

THERMAL EXPANSION;

EID: 69949154733     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.actamat.2009.07.015     Document Type: Article

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