Incipient yielding behavior during indentation for gold thin films before and after annealing

Journal of Materials Research

Volumn 21, Issue 10, 2006, Pages 2480-2492

  Miller, David C ^a   Talmage, Mellisa J ^a   Gall, Ken ^b  

^a UCB 450   (United States)

^b Georgia Institute of Technology   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

GOLD THIN FILMS; HALL-PETCH;

ANISOTROPY; CRYSTALLOGRAPHY; DEFORMATION; DIFFUSION; GOLD; GRAIN SIZE AND SHAPE; HARDNESS; INDENTATION; POLYCRYSTALLINE MATERIALS; STRAIN RATE;

THIN FILMS;

EID: 33749832623     PISSN: 08842914     EISSN: None     Source Type: Journal    
DOI: 10.1557/jmr.2006.0303     Document Type: Article

References (54)

1. J.F. Smith and S. Zheng: High temperature nanoscale mechanical property measurements. Surf. Eng. 16, 143 (2000).
2. T. Ohmura, S. Matsuoka, K. Tanaka, and T. Yoshida: Nanoindentation load-displacement behavior of pure face centered cubic metal thins films on a hard substrate. Thin Solid Films 385, 198 (2001).
3. C. Xie, R.D. Emery, S.Y. Yang, and W. Tong: Mechanical properties and stresses in thin gold films on a silicon substrate, in Thin Films: Stresses and Mechanical Properties IX, edited by C.S. Ozkan, L.B. Freund, R.C. Cammarata, and H. Gao (Mater. Res. Soc. Symp. Proc. 695, Warrendale, PA, 2002), L5.2. p. 197.
4. N.R. Moody, D.P. Adams, T. Headley, N. Yang, and A, Volinsky: Effects of diffusion on interfacial fracture of gold-chromium hybrid. Int. J. Fract. 119, 407 (2003).
5. E.T. Lilleodden, J.A. Zimmerman, S.M. Foiles, and W.D. Nix: Atomistic simulations of elastic deformation and dislocation nucleation during nanoindentation. J. Mech. Phys. Solids 51, 901 (2003).
6. C. San Marchi, N.R. Moody, M.J. Cordill, G. Lucadamo, J.J. Kelly, T. Headley, and N. Yang: Structure-property relationships of Au films electrodeposited on Ni, in Nanoscale Materials and Modeling - Relations Among Processing. Microstructure and Mechanical Properties, edited by P.M. Anderson, T. Foecke, A. Misra, and R.E. Rudd (Mater. Res. Soc. Symp. Proc. 821, Warrendale, PA, 2004), P2.8, p. 5.
7. A.A. Volinsky, N.R. Moody, and W.W. Gerberich: Nanoindentation of An and Pt/Cu thin films at elevated temperatures. J. Mater. Res. 19, 2650 (2004).
8. W.D. Nix, J.R. Greer, G. Feng, and E.T. Lilleodden: Deformation at the nanometer and micrometer length scales: Effects of strain gradients and dislocation starvation. JOM 56, 88 (2004).
9. E.T. Lilleodden and W.D. Nix: Microstructural length-scale effects in the nanoindentation behavior of thin gold films. Acta Mater. 56, 1583 (2006).
10. P. Shukla, A.K. Sikder, P.B. Zantye, A. Kumar, and M. Sanganaria: Effect of annealing on the structural, mechanical, and tribological properties of electroplated Cu thin films, in Materials, Technology and Reliability for Advanced Interconnects and Low-k Dielectrics - 2004, edited by R.J. Carter, C.S. Hau-Riege, G.M. Kloster, T.-M. Lu, and S.E. Schulz (Mater. Res. Soc. Symp. Proc. 812, Warrendale, PA, 2004), F3.16, p. 171.
11. V. Srinivassarao, R. Jayaganthan, V.N. Sekhar, K. Mohankumar, and A.A.O. Tay: Nanoindentation study of the sputtered Cu thin films for interconnect applications, in Proc. IEEE Elect. Pack. Technol. Conf., edited by R. Carter, C. Hau-Riege, G. Kloster, T-M. Lu, and S. Schulz (IEEE, Piscataway, NJ, 2004), p. 343.
12. J.A. Knapp, D.M. Follstaedt, S.M. Meyers, J.C. Barbour, and T.A. Friedman: Finite-element modeling of nanoindentation. J. Appl. Phys. 85, 1460 (1999).
13. A. Shugurov, A. Panin, H.G. Chun, and K. Oskomov: Surface morphology, microstructure and mechanical properties of thin Ag films. Proc. KORUS 11, 21 (2003).
14. R.E. Winter: Effect of thickness on the plastic deformation of (100) silver films. Philos. Mag. 29, 513 (1974).
15. T.F. Page, W.C. Oliver, and C.J. McHargue: The deformation behavior of ceramic crystals subjected to very low load (Nano)indentations. J. Mater. Res. 7, 450 (1992).
16. J.D. Kielly and J.E. Houston: Nanomechanical properties of Au (111), (001), and (110) surfaces. Phys. Rev. B 57, 12588 (1998).
17. D.E. Kramer, K.B. Yoder, and W.W. Gerberich: Surface constrained plasticity: Oxide rupture and the yield point process. Philos. Mag. A 81, 2033 (2001).
18. V. Domnich, D. Ge, and Y. Gogotsi: Indentation-induced phase transformations in semiconductors, in High-Pressure Surface Science and Engineering, edited by V. Domnich and Y. Gogotsi (IOP, Philadelphia, PA, 2004) p. 381.
19. N. Gane and J.M. Cox: The micro-hardness of metals at very low loads. Philos. Mag. 22, 881 (1970).
20. J.B. Pethica, R. Hutchinson, and W.C. Oliver: Hardness measurement at penetration depths as small as 20 nm. Philos. Mag. A 48, 593 (1983).
21. G.M. Pharr and W.C. Oliver: Nanoindentation of silver - Relations between hardness and dislocation structure. J. Mater. Res. 4, 94 (1989).
22. J.W. Hutchinson: Plasticity at the micron scale. Int. J. Solid Struct. 37, 225 (2000).
23. C.A. Schuh, J.K. Mason, and A.C. Lund: Quantitative insight into dislocation nucleation from high-temperature nanoindentation experiments. Nat. Mater. 41, 617 (2005).
24. D. Koester, A. Cowen, R. Mahadevan, M. Stonefeild, and B. Hardy: Poly-MUMPs Design Handbook, Revision 10 (MEMSCAP Inc., Research Triangle Park, NC, 2003).
25. D.C. Miller, C.F. Herrmann, H.J. Maier, S.M. George, C.R. Stoldt, and K. Gall: Thermo-mechanical evolution of multilayer thin films, Part 2. Microstructure evolution in the metallic layers. Thin Solid Films (in press).
26. D.L. Joslin and W.C. Oliver: A new method for analyzing data from continuous depth-sensing microindentation tests. J. Mater. Res. 5, 123 (1990).
27. W.C. Oliver and G.M. Pharr: Measurement of hardness and elastic modulus by instrumented indentation: Advances in understanding and refinements to methodology. J. Mater. Res. 19, 3 (2004).
28. J.H. Strader, S. Shim, H. Bei, W.C. Oliver, and G.M. Pharr: An experimental evaluation of the constant β relating the contact stiffness to the contact area in nanoindentation, in Fundamentals of Nanoindentation and Nanotribology III, edited by K.J. Wahl, N. Huber, A.B. Mann, D.F. Bahr, and Y-T. Cheng (Mater. Res. Soc. Symp. Proc. 841, Warrendale, PA, 2005), R1.4, p. 9.
29. B.N. Lucas and W.C. Oliver: Indentation power-law creep of high purity films. Metall. Trans. A 30, 601 (1999).
30. G.M. Pharr and W.C. Oliver: Measurement of thin-film mechanical-properties using nanoindentation. MRS Bull. 17(7), 28 (1992).
31. Y.T. Cheng and C.M. Cheng: What is indentation hardness? Surf. Coat. Technol. 133-134, 417 (2000).
32. T.D. Riney: Residual thermoelastic stresses in bonded silicon wafers. J. Appl. Phys. 32(3), 454 (1961).
33. M.A. Meyers and K.K. Chawla: Mechanical Behavior of Materials (Prentice-Hall, Upper Saddle River, NJ, 1999), pp. 88-91.
34. M. Levy: Handbook of Elastic Properties of Solids, Liquids, and Gases: Volume II Elastic Properties of Solids (Academic Press, San Diego, CA, 2001).
35. J.J. Vlassak and W.D. Nix: Measuring the elastic properties of anisotropic materials by means of indentation experiments. J. Mech. Phys. Solids 42, 1223 (1994).
36. J.J. Vlassak, M. Ciavarella, J.R. Barber, and X. Wang: The indentation modulus of elastically anisotropic materials for indentors of arbitrary shape. J. Mech. Phys. Solids 51, 1701 (2002).
37. R. Hill: The elastic behavior of crystalline aggregate. Proc. Phys. Soc. A 65, 349 (1952).
38. R. Nowak and M. Sakai: The anisotropy of surface deformation of sapphire: Continuous indentation of triangular indentor. Acta Mater. 42, 2879 (1994).
39. A. Fischer-Cripps: Nanoindentation (Springer, New York, 2002).
40. K.L. Johnson: Contact Mechanics (Cambridge University Press, Cambridge, UK, 1985).
41. 2 analysis to deconvolute the nanoindentation response of hard-coated systems. J. Mater. Res. 14, 2283 (1999).
42. 2 - A new approach using the continuous stiffness technique, in Fundamentals of Nanoindentation and Nanotribology, edited by N.R. Moody, W.W. Gerberich, N. Burnham, and S.P. Baker (Mater. Res. Sec. Symp. Proc. 522, Warrendale, PA, 1998), pp. 53-64.
43. E.O. Hall: The deformation and ageing of mild steel: III. Discussion of results. Proc. Phys. Soc. B 64, 747 (1951).
44. N.J. Petch: The cleavage strength of polycrystals. JISI. 173, 25 (1953).
45. D. Tabor: The Hardness of Materials (Claredon Press, Oxford, UK, 1951), pp. 174.
46. A. Bolhshakov and G.M. Pharr: Influence of pileup on the measurement of mechanical properties by load and depth sensing indentation techniques. J. Mater. Res. 13, 1049 (1998).
47. http://www.matweb.com, (Automation Creations, Inc., Blacksburg, VA), accessed March 22, 2006.
48. R.D. Emery and G.L. Povirk: Tensile behavior of free-standing gold films. Part I. Coarse grained films. Acta Mater. 51, 2067 (2003).
49. H.N. Wagar: in Integrated Device and Connection Technology, Vol. III, edited by W. Everitt (Prentice-Hall, Englewood Cliffs, NJ, 1971), pp. 469-473.
50. R. Mitra, R.A. Hoffman, A. Madan, and J.R. Weertman: Effect of process variables on the structure, residual stress, and hardness of sputtered nanocrystalline nickel films. J. Mater. Res. 16, 1010 (2001).
51. R.E. Winter: Effect of thickness on the plastic deformation of (100) silver films. Philos. Mag. 29, 513 (1974).
52. J. Mencik, D. Munz, E. Quandt, and E.R. Weppelmann: Determination of elastic modulus of thin layers using nanoindentation. J. Mater. Res. 12, 2475 (1997).
53. K.F. Jarausch, J.D. Kiely, J.E. Houston, and P.E. Russell: The correlation of stress-state and nano-mechanical properties in Au, in Fundamentals of Nanoindentation and Nanotribology, edited by N.R. Moody, W.W. Gerberich, N. Burnham, and S.P. Baker (Mater. Res. Soc. Symp. Proc. 522, Warrendale, PA, 1998), pp. 119-124.
54. S.P. Baker, A. Kretschman, and E. Artz: Thermomechanical behavior of different texture components in Cu thin films. Acta Mater. 49, 2145 (2001).