A multilayer model for describing hardness variations of aged porous silicon low-dielectric-constant thin films

Thin Solid Films

Volumn 518, Issue 1, 2009, Pages 213-221

  Rahmoun, K ^a   Iost, A ^b   Keryvin, V ^c   Guillemot, G ^b   Sari, N E Chabane ^a  

^a UNIVERSITY OF TLEMCEN   (Algeria)

^b ARTS ET MÉTIERS PARISTECH   (France)

^c UNIVERSITÉ DE RENNES 1   (France)

Author keywords

Composite hardness modelling; Instrumented indentation testing; Low k dielectric thin film; Martens hardness; Porous Si film

Indexed keywords

COMPOSITE HARDNESS MODELLING; INSTRUMENTED-INDENTATION TESTING; LOW-K DIELECTRIC THIN FILM; MARTENS HARDNESS; POROUS SI FILM;

DIELECTRIC MATERIALS; FILM PREPARATION; HARDNESS; HARDNESS TESTING; MECHANICAL PROPERTIES; MULTILAYER FILMS; MULTILAYERS; SEMICONDUCTING SILICON COMPOUNDS; SUBSTRATES; THIN FILM DEVICES;

POROUS SILICON;

EID: 69549129506     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2009.07.040     Document Type: Article

References (56)

1. Uhlir A. Bell Syst. Tech. J. 35 (1956) 333
2. Turner D.R. J. Electrochem. Soc. 105 (1958) 402
3. Canham L.T. Appl. Phys. Lett. 57 (1990) 1046
4. Kim H.-S., Xie Y.-H., De Vincentis M., Itoh T., and Jenkins K.A. J. Appl. Phys. 93 (2003) 4226
5. Fujikane M., Nagao S., Liu X.W., Chrobak D., Lehto A., Yamanaka S., and Nowak R. J. Alloys Compd. 48 (2008) 293
6. Chang S.-Y., and Huang Y.-C. Microelectron. Eng. 84 (2007) 319
7. Chang S.-Y., and Huang Y.-C. Microelectron. Eng. 83 (2006) 1940
8. Wang J., Shi F.G., Nieh T.G., Zhao B., Brongo M.R., Qu S., and Rosenmayer T. Scr. Mater. 42 (2000) 687
9. Cullis A.G., and Canham L.T. Nature 353 (1991) 335
10. Pirasteh P., Charrier J., Soltani A., Haesaert S., Haji L., Godon C., and Errien N. Appl. Surf. Sci. 253 (2006) 1999
11. Brunauer S., Emmet P.H., and Teller E. J. Am. Chem. Soc. 60 (1938) 309
12. Bomchil G., Herino R., Barla K., and Pfister J.C. J. Electrochem. Soc. 130 (1983) 1611
13. Bisi O., Ossicini S., and Pavesi L. Surf. Sci. Rep. 38 (2000) 1
14. S. Billat, PhD Thesis, Université de Grenoble 1, France, 1994.
15. Petrova E.A., Bogoslovskaya K.N., Balagurov L.A., and Kochoradze G.I. Mater. Sci. Eng., B 69/70 (2000) 152
16. Seitzman L.E. J. Mater. Res. 13 (1998) 2936
17. Oliver W.C., and Pharr G.M. J. Mater. Res. 19 (2004) 3
18. Li H., and Bradt R.C. J. Mater. Sci. 31 (1996) 1065
19. Gong J., Miao H., Zhao Z., and Guan Z. Mater. Sci. Eng., A 303 (2001) 179
20. Feltham P., and Banerjee R. J. Mater. Sci. 27 (1992) 1626
21. Anandakumar V.M., and Khadar A. Cryst. Res. Technol. 43 (2008) 193
22. Nowak R., Li C.L., and Swain M.V. Mater. Sci. Eng., A 253 (1998) 67
23. Saha R., and Nix W.D. Acta Mater. 50 (2002) 23
24. Hu L., Zhang X., Sun Y., and Williams R.J.J. J. Sol-Gel Sci. Technol. 34 (2005) 41
25. Bernard O., Huntz A.M., Andrieux M., Seiler W., Ji V., and Poinsonnet S. Appl. Surf. Sci. 253 (2007) 4626
26. Lin Y.-H., Chen T.-C., Yang P.F., Jian S.-R., and Lai Y.-S. Appl. Surf. Sci. 254 (2007) 1415
27. Bellet D., Lamagnère P., Vincent A., and Bréchet Y. J. Appl. Phys. 80 (1996) 3772
28. Shen L., and Zeng K. Microelectron. Eng. 71 (2004) 221
29. Johnson M., Li Z., Wang J., and Yan Y. Thin Solid Films 515 (2007) 3164
30. Nay R.J., Warren O.L., Wang D., and Wyrobek T.J. Microelectron. Eng. 75 (2004) 103
31. Zeng K. Z-K. Chen, L. Shen, B. Liu. Thin Solid Films 477 (2005) 111
32. Lee K.H., Yim J.-H., and Baklanov M.R. Microporous Mesopororous Mater. 94 (2006) 113
33. Yu S., Wong T.K.S., Hu X., and Yong M.S. J. Sol-Gel Sci. Technol. 35 (2005) 69
34. Yu S., Wong T.K.S., Hu X., Wei J., and Yong M.S. Microelecton. Eng. 77 (2005) 125
35. Vella J.B., Adhihetty I.S., Junker K., and Volinsky A.A. Int. J. Fract. 119/120 (2003) 487
36. Vitiello J., Fuchsmann A., Chapelon L.-L., Arnal V., Barbier D., and Torres J. Microelectron. Eng. 82 (2005) 422
37. Jönsson B., and Hogmark S. Thin Solid Films 114 (1984) 257
38. Bouzakis K.D., and Michailidis N. Thin Solid Films 494 (2006) 155
39. Jang B.K. J. Alloys Compd. 426 (2006) 312
40. Ullner C., Beckmann J., and Morrell R. J. Eur. Ceram. Soc. 22 (2002) 1183
41. Fischer-Cripps A.C., Karvánková P., and Vepřek S. Surf. Coat. Technol. 200 (2006) 5645
42. Bückle H. In: Westbrook J.H., and Conrad H. (Eds). The Science of Hardness testing and its research applications (1971), American Society of Metals, Metals Park, Ohio 453
43. Bückle H. L'essai de microdureté et ses applications vol. 90 (1960), Publications Scientifiques et Techniques du Ministère de l'Air, Paris in French
44. Vingsbo O., Hogmark S., Jönsson B., and Ingemarson A. In: Blau P.J., and Lawn B.R. (Eds). Microindentation Techniques in Materials Science and Engineering ASTM STP 889 (1986), American Society for Testing and Materials, Philadelphia 257
45. Farges G., and Degout D. Thin Solid Films 181 (1989) 365
46. Iost A., and Bigot R. J. Mater. Sci. 31 (1996) 3573
47. Beegan D., and Laugier M.T. Surf. Coat. Technol. 199 (2005) 32
48. Puchi-Cabrera E.S. Surf. Coat. Technol. 160 (2002) 177
49. Korsunsky A.M., McGurk M.R., Bull S.J., and Page T.F. Surf. Coat. Technol. 99 (1998) 171
50. Iost A., and Bigot R. Surf. Coat. Technol. 80 (1996) 117
51. Cai X., and Bangert H. Thin Solid Films 264 (1995) 59
52. Zhou X.Y., Jiang Z., Wang H., and Yu R. Mater. Sci. Eng., A 488 (2008) 318
53. Engel P.A., Hsue E.Y., and Bayer R.G. Wear 162/164 (1993) 538
54. Engel P.A., Chitsaz A.R., and Hsue E.Y. Thin Solid Films 207 (1992) 144
55. Iost A., Najjar D., and Hellouin R. Surf. Coat. Technol. 165 (2003) 126
56. Kao P.-W., and Byrne J.G. Fatigue Fract. Eng. Mater. Struct. 3 (1981) 271