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Volumn 71, Issue 2, 2004, Pages 221-228

Comparison of mechanical properties of porous and non-porous low-k dielectric films

Author keywords

Elastic modulus; Hardness; Low k films; Nanoindentation

Indexed keywords

ATOMIC FORCE MICROSCOPY; CHEMICAL MECHANICAL POLISHING; DEFORMATION; ELASTIC MODULI; HARDNESS; INDENTATION; PERMITTIVITY; POROUS MATERIALS; SCANNING ELECTRON MICROSCOPY; STIFFNESS; THERMODYNAMIC STABILITY;

EID: 0347601892     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2003.11.006     Document Type: Article
Times cited : (47)

References (26)
  • 9
    • 0346796102 scopus 로고    scopus 로고
    • Available from http://www.dow.com/dow_news/prodbus/2003/20030610c.htm.
  • 26
    • 0346796099 scopus 로고    scopus 로고
    • Available from http://www.dow.com/silk/now/index.htm.


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.