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Volumn 71, Issue 2, 2004, Pages 221-228
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Comparison of mechanical properties of porous and non-porous low-k dielectric films
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Author keywords
Elastic modulus; Hardness; Low k films; Nanoindentation
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Indexed keywords
ATOMIC FORCE MICROSCOPY;
CHEMICAL MECHANICAL POLISHING;
DEFORMATION;
ELASTIC MODULI;
HARDNESS;
INDENTATION;
PERMITTIVITY;
POROUS MATERIALS;
SCANNING ELECTRON MICROSCOPY;
STIFFNESS;
THERMODYNAMIC STABILITY;
NANOIDENTATION;
NON POROUS FILMS;
DIELECTRIC FILMS;
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EID: 0347601892
PISSN: 01679317
EISSN: None
Source Type: Journal
DOI: 10.1016/j.mee.2003.11.006 Document Type: Article |
Times cited : (47)
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References (26)
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