Comparison of mechanical properties of porous and non-porous low-k dielectric films

Microelectronic Engineering

Volumn 71, Issue 2, 2004, Pages 221-228

  Shen, Lu ^a   Zeng, Kaiyang ^a  

^a INSTITUTE OF MATERIALS RESEARCH AND ENGINEERING   (Singapore)

Author keywords

Elastic modulus; Hardness; Low k films; Nanoindentation

Indexed keywords

ATOMIC FORCE MICROSCOPY; CHEMICAL MECHANICAL POLISHING; DEFORMATION; ELASTIC MODULI; HARDNESS; INDENTATION; PERMITTIVITY; POROUS MATERIALS; SCANNING ELECTRON MICROSCOPY; STIFFNESS; THERMODYNAMIC STABILITY;

NANOIDENTATION; NON POROUS FILMS;

DIELECTRIC FILMS;

EID: 0347601892     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2003.11.006     Document Type: Article

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