Impact of dielectric stack and interface adhesion on mechanical properties of porous ultra low-k

Microelectronic Engineering

Volumn 82, Issue 3-4 SPEC. ISS., 2005, Pages 422-426

  Vitiello, Julien ^a,b   Fuchsmann, Arno ^c   Chapelon, Laurent Luc ^c   Arnal, Vincent ^c   Barbier, Daniel ^b   Torres, Joaquin ^c  

^a NXP SEMICONDUCTORS   (Netherlands)

^b INSTITUT DES NANOTECHNOLOGIES DE LYON   (France)

^c STMICROELECTRONICS   (France)

Author keywords

Delamination; Mechanical properties; Nanoindentation; Porous dielectric; Ultra low k

Indexed keywords

ADHESION; CRACKS; DELAMINATION; ELASTIC MODULI; HARDNESS; INDENTATION; MECHANICAL PROPERTIES; POROSITY; STIFFNESS;

NANOINDENTATION; POROUS DIELECTRICS; ULTRA LOW-K;

DIELECTRIC MATERIALS;

EID: 28044434097     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2005.07.026     Document Type: Conference Paper

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