Investigation on methods for dealing with pile-up errors in evaluating the mechanical properties of thin metal films at sub-micron scale on hard substrates by nanoindentation technique

Materials Science and Engineering: A

Volumn 488, Issue 1-2, 2008, Pages 318-332

  Zhou, Xiangyang ^a   Jiang, Zhuangde ^a,b   Wang, Hairong ^a   Yu, Ruixia ^c  

^a XI'AN JIAOTONG UNIVERSITY   (China)

^b XI'AN JIAOTONG UNIVERSITY   (China)

^c UNIVERSITY OF SCIENCE AND TECHNOLOGY BEIJING   (China)

Author keywords

Elastic modulus; Hardness; Nanoindentation; Pile up; Thin metal films

Indexed keywords

ELASTIC MODULI; ERROR ANALYSIS; HARDNESS; NANOINDENTATION; THIN FILMS;

CONSTANT MODULUS ASSUMPTION ANALYSIS; CONTACT AREA; CONTACT DEPTH; THIN METAL FILMS;

METALS;

ELASTIC MODULI; ERROR ANALYSIS; HARDNESS; METALS; NANOINDENTATION; THIN FILMS;

EID: 44049084037     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2008.01.020     Document Type: Article

References (37)