Mechanical characterization of low-k dielectric materials using nanoindentation

Microelectronic Engineering

Volumn 75, Issue 1, 2004, Pages 103-110

  Nay, R J ^a   Warren, O L ^a   Yang, D ^a   Wyrobek, T J ^a  

^a Bruker Corporation   (United States)

Author keywords

Low k films; Mechanical properties; Nanoindentation

Indexed keywords

CHEMICAL VAPOR DEPOSITION; MECHANICAL PROPERTIES; METALLIC FILMS; MICROELECTRONICS; NANOSTRUCTURED MATERIALS; POLARIZATION; POROSITY; SILICON COMPOUNDS; STRENGTH OF MATERIALS; SUBSTRATES;

GATE DELAYS; LOW-K FILMS; NANOINDENTATION; POLARIZABILITY;

DIELECTRIC MATERIALS;

EID: 2942602851     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2004.01.043     Document Type: Conference Paper

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