Analyses of interface adhesion between porous SiO2 low-k film and SiC/SiN layers by nanoindentation and nanoscratch tests

Microelectronic Engineering

Volumn 84, Issue 2, 2007, Pages 319-327

  Chang, Shou Yi ^a   Huang, Yi Chung ^a  

^a NATIONAL CHUNG HSING UNIVERSITY   (Taiwan)

Author keywords

Bonding configuration; Dielectrics; Interface adhesion

Indexed keywords

CHEMICAL BONDS; DIELECTRIC MATERIALS; INTERFACES (COMPUTER); NANOSTRUCTURED MATERIALS; NANOTECHNOLOGY; THIN FILMS;

BONDING CONFIGURATION; INTERFACE ADHESION; NANOINDENTATION; NANOSCRATCH TESTS;

SILICA;

EID: 33846224794     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2006.10.086     Document Type: Article

References (27)

1. Homma T. Mater. Sci. Eng. R R23 (1998) 243
2. Maex K., Baklanov M.R., Shamiryan D., Lacopi F., Brongersma S.H., and Yanovitskaya Z.S. J. Appl. Phys. 93 (2003) 8793
3. Wu Z.C., Shiung Z.W., Wu R.G., Liu Y.L., Wu W.H., Tsui B.Y., Chen M.C., Chang W., Chou P.F., Jang S.M., Hu C.H., and Liang M.S. J. Electrochem. Soc. 148 (2001) F109
4. Rajagopal A., Gregoire C., Lemaire J.J., Pireaux J.J., Baklanov M.R., Vanhaelemeersch S., Maex K., and Waeterloos J.J. J. Vac. Sci. Technol. B 17 (1999) 2336
5. Chang S.Y., Chou T.J., Lu Y.C., Jang S.M., Lin S.J., and Liang M.S. J. Electrochem. Soc. 151 (2004) F146
6. Chang S.Y., Jang S.M., Lin S.J., and Liang M.S. Thin Solid Films 466 (2004) 54
7. Gorman B.P., Orozco-Teran R.A., Roepsch J.A., Dong H.J., Reidy R.F., and Mueller D.W. Appl. Phys. Lett. 79 (2001) 4010
8. Chang S.Y., and Huang Y.C. Microelectron. Eng. 83 (2006) 1940
9. Freund L.B., and Suresh S. Thin Film Materials - Stress, Defect Formation and Surface Evaluation (2003), Cambridge University Press, New York
10. Beaudoin S., Graham S., Jaiswal R., Kilroy C., S Kim B., Kumar G., and Smith S. Interface 14 (2005) 35
11. Chang S.Y., Chang H.L., Lu Y.C., Jang S.M., Lin S.J., and Liang M.S. Thin Solid Films 460 (2004) 167
12. Volinsky A.A., Moody N.R., and Gerberich W.W. Acta Mater. 50 (2002) 441
13. Ma Q. J. Mater. Res. 12 (1997) 840
14. Dauskardt R.H., Lane M., Ma Q., and Krishna N. Eng. Fracture Mech. 61 (1998) 141
15. Oliver W.C., and Pharr G.M. J. Mater. Res. 7 (1992) 1564
16. Fischer-Cripps A.C. Nanoindentation (2002), Springer-Verlag, New York
17. Gouldstone A., Koh H.J., Zeng K.Y., Giannakopoulos A.E., and Suresh S. Acta Mater. 48 (2000) 2277
18. Chang S.Y., Chang T.Q., and Lee Y.S. J. Electrochem. Soc. 10 (2005) C657
19. Volinsky A.A., Vella J.B., and Gerberich W.W. Thin Solid Films 429 (2003) 201
20. Dharma Raju T., Nakasa K., and Kato M. Acta Mater. 51 (2003) 457
21. Bull S.J. J. Phys. D 38 (2005) R393
22. Malzbender J., et al. Mater. Sci. Eng. 36 (2002) 47
23. Bull S.J., and Rickerby D.S. Surf. Coat. Technol. 42 (1990) 151
24. Bull S.J. Surf. Coat. Technol. 50 (1991) 25
25. Benayoun S., Fouilland-Paillé L., and Hantzpergue J.J. Thin Solid Films 352 (1999) 156
26. Lee J.H., Kim W.M., Lee T.S., Chung M.K., Cheong B.K., and Kim S.G. Surf. Coat. Technol. 133-134 (2000) 220
27. Akimune Y., Akiba T., Hirosaki N., and Izumi T. J. Mater. Sci. 29 (1994) 3243