-
1
-
-
0036474722
-
Impact of die-to-die and within-die parameterfluctuations on the maximum clock frequency distribution for gigascale integration
-
Feb
-
K. A. Bowman, S. G. Duvall, and J. D. Meindl, "Impact of die-to-die and within-die parameterfluctuations on the maximum clock frequency distribution for gigascale integration," IEEE J. Solid-State Circuits, vol. 37, no. 2, pp. 183-190, Feb. 2002.
-
(2002)
IEEE J. Solid-State Circuits
, vol.37
, Issue.2
, pp. 183-190
-
-
Bowman, K.A.1
Duvall, S.G.2
Meindl, J.D.3
-
3
-
-
39749152930
-
Impact of layout on 90 nm CMOS process parameterfluctuations
-
Honolulu, Hawaii, Jun
-
L.-T. Pang and B. Nikolić, "Impact of layout on 90 nm CMOS process parameterfluctuations," in 2006 Symp. VLSI Circuits Dig. Tech. Papers, Honolulu, Hawaii, Jun. 2006, pp. 69-70.
-
(2006)
2006 Symp. VLSI Circuits Dig. Tech. Papers
, pp. 69-70
-
-
Pang, L.-T.1
Nikolić, B.2
-
4
-
-
66149185555
-
Measurements and analysisof process variability in 90 nm CMOS
-
May
-
L.-T. Pang andB. Nikolić, "Measurements and analysisof process variability in 90 nm CMOS," IEEE J. Solid-State Circuits, vol. 44, no. 5, pp. 1655-1663, May 2009.
-
(2009)
IEEE J. Solid-State Circuits
, vol.44
, Issue.5
, pp. 1655-1663
-
-
Pang andB, L.-T.1
Nikolić2
-
5
-
-
0034429814
-
Delay variability: Sources, impacts and trends
-
San Francisco, CA, Feb
-
S. Nassif, "Delay variability: Sources, impacts and trends," in 2000 IEEE Int. Solid-State Circuits Conf. Dig. Tech. Papers, San Francisco, CA, Feb. 2000, pp. 368-369.
-
(2000)
2000 IEEE Int. Solid-State Circuits Conf. Dig. Tech. Papers
, pp. 368-369
-
-
Nassif, S.1
-
6
-
-
0036858210
-
Adaptive body bias for reducing impacts of die-to-die and within-die parameter variations on microprocessor frequency and leakage
-
Nov
-
J. W. Tschanz et al., "Adaptive body bias for reducing impacts of die-to-die and within-die parameter variations on microprocessor frequency and leakage," IEEE J. Solid-State Circuits, vol. 37, no. 11, pp. 1396-1402, Nov. 2002.
-
(2002)
IEEE J. Solid-State Circuits
, vol.37
, Issue.11
, pp. 1396-1402
-
-
Tschanz, J.W.1
-
7
-
-
0032674029
-
Subwavelength lithography and its potential impact on design and eda
-
New Orleans, LA, Jun
-
A. B. Kahng and Y. C. Pati, "Subwavelength lithography and its potential impact on design and eda," in Proc. 36th Design Automation Conf. 1999, New Orleans, LA, Jun. 1999, pp. 799-804.
-
(1999)
Proc. 36th Design Automation Conf. 1999
, pp. 799-804
-
-
Kahng, A.B.1
Pati, Y.C.2
-
8
-
-
0033714120
-
Modeling line edge roughness effects in sub 100 nanometer gate length devices
-
Seattle, WA, Sep
-
P. Oldiges, Q. Lin, K. Petrillo, M. Sanchez, M. Ieong, and M. Hargrove, "Modeling line edge roughness effects in sub 100 nanometer gate length devices," in Proc. 2000 Int. Conf. Simulation of Semiconductor Processes and Devices, Seattle, WA, Sep. 2000, pp. 131-134.
-
(2000)
Proc. 2000 Int. Conf. Simulation of Semiconductor Processes and Devices
, pp. 131-134
-
-
Oldiges, P.1
Lin, Q.2
Petrillo, K.3
Sanchez, M.4
Ieong, M.5
Hargrove, M.6
-
9
-
-
0036247929
-
Intrinsic threshold voltage fluctuations in decanano MOSFETs due to local oxide thickness variations
-
A. Asenov, S. Kaya, and J. H. Davies, "Intrinsic threshold voltage fluctuations in decanano MOSFETs due to local oxide thickness variations," IEEE Trans. Electron Devices, vol. 49, pp. 112-119, 2002.
-
(2002)
IEEE Trans. Electron Devices
, vol.49
, pp. 112-119
-
-
Asenov, A.1
Kaya, S.2
Davies, J.H.3
-
10
-
-
0033280507
-
Monte Carlo modeling of threshold variation due to dopant fluctuations
-
Kyoto, Japan, Jun
-
D. J. Frank, Y. Taur, M. Ieong, and H.-S. P. Wong, "Monte Carlo modeling of threshold variation due to dopant fluctuations," in 1999 Symp. VLSI Circuits Dig. Tech. Papers, Kyoto, Japan, Jun. 1999, pp. 171-172.
-
(1999)
1999 Symp. VLSI Circuits Dig. Tech. Papers
, pp. 171-172
-
-
Frank, D.J.1
Taur, Y.2
Ieong, M.3
Wong, H.-S.P.4
-
11
-
-
4444323973
-
Fast statistical timing analysis handling arbitrary delay correlations
-
San Diego, CA, Jun. 7-11
-
M. Orshansky and A. Bandyopadhyay, "Fast statistical timing analysis handling arbitrary delay correlations," in Proc. 41st Design Automation Conf. 2004, San Diego, CA, Jun. 7-11, 2004, pp. 337-342.
-
(2004)
Proc. 41st Design Automation Conf. 2004
, pp. 337-342
-
-
Orshansky, M.1
Bandyopadhyay, A.2
-
12
-
-
46049112056
-
A cost-effective low power platform for the 45-nm technology node
-
San Francisco, CA, Dec
-
E. Josse et al., "A cost-effective low power platform for the 45-nm technology node," in 2006 IEEE Int. Electron Devices Meeting Tech. Dig., San Francisco, CA, Dec. 2006, pp. 1-4.
-
(2006)
2006 IEEE Int. Electron Devices Meeting Tech. Dig
, pp. 1-4
-
-
Josse, E.1
-
13
-
-
41149131821
-
A low cost drive current enhancement technique using shallow trench isolation induced stress for 45-nm node
-
Honolulu, HI, Jun
-
C. Cam et al., "A low cost drive current enhancement technique using shallow trench isolation induced stress for 45-nm node," in Symp. VLSI Technology Dig. Tech. Papers, Honolulu, HI, Jun. 2006, pp. 82-83.
-
(2006)
Symp. VLSI Technology Dig. Tech. Papers
, pp. 82-83
-
-
Cam, C.1
-
14
-
-
57849123487
-
Process control for 45 nm CMOS logic gate patterning
-
J. A. Allgair and C. J. Raymond, Eds. Bellingham, WA: SPIE
-
B. L. Gratiet et al., "Process control for 45 nm CMOS logic gate patterning," in Metrology, Inspection, and Process Control for Mi-crolithography XXII, Proc. SPIE, J. A. Allgair and C. J. Raymond, Eds. Bellingham, WA: SPIE, 2008, vol. 6922.
-
(2008)
Metrology, Inspection, and Process Control for Mi-crolithography XXII, Proc. SPIE
, vol.6922
-
-
Gratiet, B.L.1
-
15
-
-
33847754669
-
Uniaxial-biaxial stress hybridization for super-critical strained-Si directly on insulator (SC-SSOI) PMOS with different channel orientations
-
San Francisco, CA, Dec
-
A. V.-Y. Thean et al., "Uniaxial-biaxial stress hybridization for super-critical strained-Si directly on insulator (SC-SSOI) PMOS with different channel orientations," in 2005 IEEE Int. Electron Devices Meeting Tech. Dig., San Francisco, CA, Dec. 2005, pp. 509-512.
-
(2005)
2005 IEEE Int. Electron Devices Meeting Tech. Dig
, pp. 509-512
-
-
Thean, A.V.-Y.1
-
16
-
-
0036932273
-
Accurate modeling of trench isolation induced mechanical stress effects on MOSFET electrical performance
-
San Francisco, CA, Dec
-
R. A. Bianchi, G. Bouche, and O. R. dit Buisson, "Accurate modeling of trench isolation induced mechanical stress effects on MOSFET electrical performance," in 2002 IEEE Int. Electron Devices Meeting Tech. Dig., San Francisco, CA, Dec. 2002, pp. 117-120.
-
(2002)
2002 IEEE Int. Electron Devices Meeting Tech. Dig
, pp. 117-120
-
-
Bianchi, R.A.1
Bouche, G.2
dit Buisson, O.R.3
-
17
-
-
33744832246
-
Scalability of strained nitride capping layers for future CMOS generations
-
Grenoble, France, Sep
-
G. Eneman, M. Jurczak, P. Verheyen, T. Hoffmann, A. D. Keersgieter, and K. D. Meyer, "Scalability of strained nitride capping layers for future CMOS generations," in Proc. 35th European Solid State Device Research Conf., 2005, Grenoble, France, Sep. 2005, pp. 449-452.
-
(2005)
Proc. 35th European Solid State Device Research Conf., 2005
, pp. 449-452
-
-
Eneman, G.1
Jurczak, M.2
Verheyen, P.3
Hoffmann, T.4
Keersgieter, A.D.5
Meyer, K.D.6
-
18
-
-
0030714729
-
Impact of lens aberrations on optical lithography
-
Jan./Mar
-
T. A. Brunner, "Impact of lens aberrations on optical lithography," IBM J. Research and Development, vol. 41, pp. 57-67, Jan./Mar. 1997.
-
(1997)
IBM J. Research and Development
, vol.41
, pp. 57-67
-
-
Brunner, T.A.1
-
19
-
-
0030416122
-
Effects of metal coverage on MOSFET matching
-
San Francisco, CA
-
H. Tuinhout, M. Pelgrom, R. P. de Vries, and M. Vertregt, "Effects of metal coverage on MOSFET matching," in 1996 IEEE Int. Electron Devices Meeting Tech. Dig., San Francisco, CA, 1996, pp. 735-738.
-
(1996)
1996 IEEE Int. Electron Devices Meeting Tech. Dig
, pp. 735-738
-
-
Tuinhout, H.1
Pelgrom, M.2
de Vries, R.P.3
Vertregt, M.4
-
20
-
-
27944451040
-
Design methodology for IC manufacturability based on regular logic-bricks
-
Anaheim, CA, Jun
-
V. Kheterpal et al., "Design methodology for IC manufacturability based on regular logic-bricks," in Proc. 42nd Design Automation Conf. 2005, Anaheim, CA, Jun. 2005, pp. 353-358.
-
(2005)
Proc. 42nd Design Automation Conf. 2005
, pp. 353-358
-
-
Kheterpal, V.1
-
21
-
-
0020298336
-
Gate isolation - a novel basic cell configuration for CMOS gate arrays
-
May
-
I. Ohkura, T. Noguchi, K. Sakashita, H. Ishida, T. Ichiyama, and T. Enomoto, "Gate isolation - a novel basic cell configuration for CMOS gate arrays," in Proc. IEEE Custom Integrated Circuits Conf. (CICC'82), May 1982, pp. 307-310.
-
(1982)
Proc. IEEE Custom Integrated Circuits Conf. (CICC'82)
, pp. 307-310
-
-
Ohkura, I.1
Noguchi, T.2
Sakashita, K.3
Ishida, H.4
Ichiyama, T.5
Enomoto, T.6
-
22
-
-
39649099072
-
-
VLSI Technology. Upper Saddle River, NJ: Prentice Hall
-
J. D. Plummer, M. D. Deal, and P. B. Griffin, Silicon VLSI Technology. Upper Saddle River, NJ: Prentice Hall, 2000.
-
(2000)
Silicon
-
-
Plummer, J.D.1
Deal, M.D.2
Griffin, P.B.3
-
23
-
-
64349103196
-
Across wafer critical dimension uniformity enhancement through lithography and etch process sequence: Concept, approach, modeling, and experiment
-
Q. Zhang et al., "Across wafer critical dimension uniformity enhancement through lithography and etch process sequence: Concept, approach, modeling, and experiment," IEEE Trans. Semiconduct. Manufact., vol. 20, pp. 488-505, 2007.
-
(2007)
IEEE Trans. Semiconduct. Manufact
, vol.20
, pp. 488-505
-
-
Zhang, Q.1
-
24
-
-
43249103476
-
A comprehensive model of process variability for statistical timing optimization
-
V. K. Singh and M. L. Rieger, Eds. Bellingham, WA: SPIE
-
K. Qian and C. J. Spanos, "A comprehensive model of process variability for statistical timing optimization," in Design for Manufactura-bility Through Design-Process Integration II, Proc. SPIE, V. K. Singh and M. L. Rieger, Eds. Bellingham, WA: SPIE, 2008, vol. 6925, pp. 1G-1-11.
-
(2008)
Design for Manufactura-bility Through Design-Process Integration II, Proc. SPIE
, vol.6925
-
-
Qian, K.1
Spanos, C.J.2
-
25
-
-
33947124122
-
Controlling gate-CD uniformity by means of a CD prediction model and wafer-temperature distribution control
-
Kanno et al., "Controlling gate-CD uniformity by means of a CD prediction model and wafer-temperature distribution control," Thin Solid Films, vol. 515, no. 12, pp. 4941-494, 2007.
-
(2007)
Thin Solid Films
, vol.515
, Issue.12
, pp. 4941-5494
-
-
Kanno1
-
26
-
-
43249122693
-
Layout optimization based on a generalized process variability model
-
San Jose, CA
-
Q. Y. Tang and C. J. Spanos, "Layout optimization based on a generalized process variability model," in Proc. SPIE, San Jose, CA, 2008, vol. 6925.
-
(2008)
Proc. SPIE
, vol.6925
-
-
Tang, Q.Y.1
Spanos, C.J.2
-
27
-
-
0024754187
-
Matching properties of MOS transistors
-
Oct
-
M. Pelgrom, A. Duinmaijer, and A. Welbers, "Matching properties of MOS transistors," IEEE J. Solid-State Circuits, vol. 24, no. 5, pp. 1433-1439, Oct. 1989.
-
(1989)
IEEE J. Solid-State Circuits
, vol.24
, Issue.5
, pp. 1433-1439
-
-
Pelgrom, M.1
Duinmaijer, A.2
Welbers, A.3
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