메뉴 건너뛰기




Volumn 44, Issue 8, 2009, Pages 2233-2243

Measurement and analysis of variability in 45 nm strained-Si CMOS technology

Author keywords

45 nm; CMOS; Layout; Leakage; Ring oscillators; Strain; Variability

Indexed keywords

45 NM; CMOS; LAYOUT; LEAKAGE; RING OSCILLATORS; VARIABILITY;

EID: 68549087134     PISSN: 00189200     EISSN: None     Source Type: Journal    
DOI: 10.1109/JSSC.2009.2022217     Document Type: Article
Times cited : (68)

References (27)
  • 1
    • 0036474722 scopus 로고    scopus 로고
    • Impact of die-to-die and within-die parameterfluctuations on the maximum clock frequency distribution for gigascale integration
    • Feb
    • K. A. Bowman, S. G. Duvall, and J. D. Meindl, "Impact of die-to-die and within-die parameterfluctuations on the maximum clock frequency distribution for gigascale integration," IEEE J. Solid-State Circuits, vol. 37, no. 2, pp. 183-190, Feb. 2002.
    • (2002) IEEE J. Solid-State Circuits , vol.37 , Issue.2 , pp. 183-190
    • Bowman, K.A.1    Duvall, S.G.2    Meindl, J.D.3
  • 3
    • 39749152930 scopus 로고    scopus 로고
    • Impact of layout on 90 nm CMOS process parameterfluctuations
    • Honolulu, Hawaii, Jun
    • L.-T. Pang and B. Nikolić, "Impact of layout on 90 nm CMOS process parameterfluctuations," in 2006 Symp. VLSI Circuits Dig. Tech. Papers, Honolulu, Hawaii, Jun. 2006, pp. 69-70.
    • (2006) 2006 Symp. VLSI Circuits Dig. Tech. Papers , pp. 69-70
    • Pang, L.-T.1    Nikolić, B.2
  • 4
    • 66149185555 scopus 로고    scopus 로고
    • Measurements and analysisof process variability in 90 nm CMOS
    • May
    • L.-T. Pang andB. Nikolić, "Measurements and analysisof process variability in 90 nm CMOS," IEEE J. Solid-State Circuits, vol. 44, no. 5, pp. 1655-1663, May 2009.
    • (2009) IEEE J. Solid-State Circuits , vol.44 , Issue.5 , pp. 1655-1663
    • Pang andB, L.-T.1    Nikolić2
  • 6
    • 0036858210 scopus 로고    scopus 로고
    • Adaptive body bias for reducing impacts of die-to-die and within-die parameter variations on microprocessor frequency and leakage
    • Nov
    • J. W. Tschanz et al., "Adaptive body bias for reducing impacts of die-to-die and within-die parameter variations on microprocessor frequency and leakage," IEEE J. Solid-State Circuits, vol. 37, no. 11, pp. 1396-1402, Nov. 2002.
    • (2002) IEEE J. Solid-State Circuits , vol.37 , Issue.11 , pp. 1396-1402
    • Tschanz, J.W.1
  • 7
    • 0032674029 scopus 로고    scopus 로고
    • Subwavelength lithography and its potential impact on design and eda
    • New Orleans, LA, Jun
    • A. B. Kahng and Y. C. Pati, "Subwavelength lithography and its potential impact on design and eda," in Proc. 36th Design Automation Conf. 1999, New Orleans, LA, Jun. 1999, pp. 799-804.
    • (1999) Proc. 36th Design Automation Conf. 1999 , pp. 799-804
    • Kahng, A.B.1    Pati, Y.C.2
  • 9
    • 0036247929 scopus 로고    scopus 로고
    • Intrinsic threshold voltage fluctuations in decanano MOSFETs due to local oxide thickness variations
    • A. Asenov, S. Kaya, and J. H. Davies, "Intrinsic threshold voltage fluctuations in decanano MOSFETs due to local oxide thickness variations," IEEE Trans. Electron Devices, vol. 49, pp. 112-119, 2002.
    • (2002) IEEE Trans. Electron Devices , vol.49 , pp. 112-119
    • Asenov, A.1    Kaya, S.2    Davies, J.H.3
  • 10
    • 0033280507 scopus 로고    scopus 로고
    • Monte Carlo modeling of threshold variation due to dopant fluctuations
    • Kyoto, Japan, Jun
    • D. J. Frank, Y. Taur, M. Ieong, and H.-S. P. Wong, "Monte Carlo modeling of threshold variation due to dopant fluctuations," in 1999 Symp. VLSI Circuits Dig. Tech. Papers, Kyoto, Japan, Jun. 1999, pp. 171-172.
    • (1999) 1999 Symp. VLSI Circuits Dig. Tech. Papers , pp. 171-172
    • Frank, D.J.1    Taur, Y.2    Ieong, M.3    Wong, H.-S.P.4
  • 11
    • 4444323973 scopus 로고    scopus 로고
    • Fast statistical timing analysis handling arbitrary delay correlations
    • San Diego, CA, Jun. 7-11
    • M. Orshansky and A. Bandyopadhyay, "Fast statistical timing analysis handling arbitrary delay correlations," in Proc. 41st Design Automation Conf. 2004, San Diego, CA, Jun. 7-11, 2004, pp. 337-342.
    • (2004) Proc. 41st Design Automation Conf. 2004 , pp. 337-342
    • Orshansky, M.1    Bandyopadhyay, A.2
  • 12
    • 46049112056 scopus 로고    scopus 로고
    • A cost-effective low power platform for the 45-nm technology node
    • San Francisco, CA, Dec
    • E. Josse et al., "A cost-effective low power platform for the 45-nm technology node," in 2006 IEEE Int. Electron Devices Meeting Tech. Dig., San Francisco, CA, Dec. 2006, pp. 1-4.
    • (2006) 2006 IEEE Int. Electron Devices Meeting Tech. Dig , pp. 1-4
    • Josse, E.1
  • 13
    • 41149131821 scopus 로고    scopus 로고
    • A low cost drive current enhancement technique using shallow trench isolation induced stress for 45-nm node
    • Honolulu, HI, Jun
    • C. Cam et al., "A low cost drive current enhancement technique using shallow trench isolation induced stress for 45-nm node," in Symp. VLSI Technology Dig. Tech. Papers, Honolulu, HI, Jun. 2006, pp. 82-83.
    • (2006) Symp. VLSI Technology Dig. Tech. Papers , pp. 82-83
    • Cam, C.1
  • 14
    • 57849123487 scopus 로고    scopus 로고
    • Process control for 45 nm CMOS logic gate patterning
    • J. A. Allgair and C. J. Raymond, Eds. Bellingham, WA: SPIE
    • B. L. Gratiet et al., "Process control for 45 nm CMOS logic gate patterning," in Metrology, Inspection, and Process Control for Mi-crolithography XXII, Proc. SPIE, J. A. Allgair and C. J. Raymond, Eds. Bellingham, WA: SPIE, 2008, vol. 6922.
    • (2008) Metrology, Inspection, and Process Control for Mi-crolithography XXII, Proc. SPIE , vol.6922
    • Gratiet, B.L.1
  • 15
    • 33847754669 scopus 로고    scopus 로고
    • Uniaxial-biaxial stress hybridization for super-critical strained-Si directly on insulator (SC-SSOI) PMOS with different channel orientations
    • San Francisco, CA, Dec
    • A. V.-Y. Thean et al., "Uniaxial-biaxial stress hybridization for super-critical strained-Si directly on insulator (SC-SSOI) PMOS with different channel orientations," in 2005 IEEE Int. Electron Devices Meeting Tech. Dig., San Francisco, CA, Dec. 2005, pp. 509-512.
    • (2005) 2005 IEEE Int. Electron Devices Meeting Tech. Dig , pp. 509-512
    • Thean, A.V.-Y.1
  • 16
    • 0036932273 scopus 로고    scopus 로고
    • Accurate modeling of trench isolation induced mechanical stress effects on MOSFET electrical performance
    • San Francisco, CA, Dec
    • R. A. Bianchi, G. Bouche, and O. R. dit Buisson, "Accurate modeling of trench isolation induced mechanical stress effects on MOSFET electrical performance," in 2002 IEEE Int. Electron Devices Meeting Tech. Dig., San Francisco, CA, Dec. 2002, pp. 117-120.
    • (2002) 2002 IEEE Int. Electron Devices Meeting Tech. Dig , pp. 117-120
    • Bianchi, R.A.1    Bouche, G.2    dit Buisson, O.R.3
  • 18
    • 0030714729 scopus 로고    scopus 로고
    • Impact of lens aberrations on optical lithography
    • Jan./Mar
    • T. A. Brunner, "Impact of lens aberrations on optical lithography," IBM J. Research and Development, vol. 41, pp. 57-67, Jan./Mar. 1997.
    • (1997) IBM J. Research and Development , vol.41 , pp. 57-67
    • Brunner, T.A.1
  • 20
    • 27944451040 scopus 로고    scopus 로고
    • Design methodology for IC manufacturability based on regular logic-bricks
    • Anaheim, CA, Jun
    • V. Kheterpal et al., "Design methodology for IC manufacturability based on regular logic-bricks," in Proc. 42nd Design Automation Conf. 2005, Anaheim, CA, Jun. 2005, pp. 353-358.
    • (2005) Proc. 42nd Design Automation Conf. 2005 , pp. 353-358
    • Kheterpal, V.1
  • 22
    • 39649099072 scopus 로고    scopus 로고
    • VLSI Technology. Upper Saddle River, NJ: Prentice Hall
    • J. D. Plummer, M. D. Deal, and P. B. Griffin, Silicon VLSI Technology. Upper Saddle River, NJ: Prentice Hall, 2000.
    • (2000) Silicon
    • Plummer, J.D.1    Deal, M.D.2    Griffin, P.B.3
  • 23
    • 64349103196 scopus 로고    scopus 로고
    • Across wafer critical dimension uniformity enhancement through lithography and etch process sequence: Concept, approach, modeling, and experiment
    • Q. Zhang et al., "Across wafer critical dimension uniformity enhancement through lithography and etch process sequence: Concept, approach, modeling, and experiment," IEEE Trans. Semiconduct. Manufact., vol. 20, pp. 488-505, 2007.
    • (2007) IEEE Trans. Semiconduct. Manufact , vol.20 , pp. 488-505
    • Zhang, Q.1
  • 24
    • 43249103476 scopus 로고    scopus 로고
    • A comprehensive model of process variability for statistical timing optimization
    • V. K. Singh and M. L. Rieger, Eds. Bellingham, WA: SPIE
    • K. Qian and C. J. Spanos, "A comprehensive model of process variability for statistical timing optimization," in Design for Manufactura-bility Through Design-Process Integration II, Proc. SPIE, V. K. Singh and M. L. Rieger, Eds. Bellingham, WA: SPIE, 2008, vol. 6925, pp. 1G-1-11.
    • (2008) Design for Manufactura-bility Through Design-Process Integration II, Proc. SPIE , vol.6925
    • Qian, K.1    Spanos, C.J.2
  • 25
    • 33947124122 scopus 로고    scopus 로고
    • Controlling gate-CD uniformity by means of a CD prediction model and wafer-temperature distribution control
    • Kanno et al., "Controlling gate-CD uniformity by means of a CD prediction model and wafer-temperature distribution control," Thin Solid Films, vol. 515, no. 12, pp. 4941-494, 2007.
    • (2007) Thin Solid Films , vol.515 , Issue.12 , pp. 4941-5494
    • Kanno1
  • 26
    • 43249122693 scopus 로고    scopus 로고
    • Layout optimization based on a generalized process variability model
    • San Jose, CA
    • Q. Y. Tang and C. J. Spanos, "Layout optimization based on a generalized process variability model," in Proc. SPIE, San Jose, CA, 2008, vol. 6925.
    • (2008) Proc. SPIE , vol.6925
    • Tang, Q.Y.1    Spanos, C.J.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.