Fabrication and interface characterization of a microchannel system using a simple alignment technique

Sensor Letters

Volumn 5, Issue 3-4, 2007, Pages 584-591

  Srinivasan, K ^a   Subbarao, P M V ^a   Kale, S R ^a   Chandra, S ^a  

^a INDIAN INSTITUTE OF TECHNOLOGY DELHI   (India)

Author keywords

Front to back alignment; Infrared image; Interface study; Microchannel; Wafer to wafer bonding

Indexed keywords

ATOMIC FORCE MICROSCOPY; BONDING; CHARACTERIZATION; INFRARED IMAGING; INTERFACES (MATERIALS); OPTICAL MICROSCOPY; PROFILOMETRY; SCANNING ELECTRON MICROSCOPY; SILICON WAFERS;

INTERFACE CHARACTERIZATION; MICROCHANNEL SYSTEM; SURFACE PROFILOMETER; WAFER-TO-WAFER BONDING;

MICROCHANNELS;

EID: 37349035106     PISSN: 1546198X     EISSN: None     Source Type: Journal    
DOI: 10.1166/sl.2007.236     Document Type: Article

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