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Volumn 82, Issue 1, 2000, Pages 229-233
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Wafer level packaging of silicon pressure sensors
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Author keywords
[No Author keywords available]
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Indexed keywords
BONDING;
CROSSLINKING;
ELASTOMERS;
MASKS;
PHOTOLITHOGRAPHY;
PRESSURE TRANSDUCERS;
SILICON WAFERS;
SILICONES;
ULTRAVIOLET RADIATION;
PRESSURE SENSORS;
SILICON SENSORS;
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EID: 0033752127
PISSN: 09244247
EISSN: None
Source Type: Journal
DOI: 10.1016/S0924-4247(99)00334-9 Document Type: Article |
Times cited : (24)
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References (7)
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