Effect of additives and pulse plating on copper nucleation onto Ru

Electrochimica Acta

Volumn 54, Issue 4, 2009, Pages 1177-1183

  Emekli, Ugur ^a   West, Alan C ^a  

^a Columbia University ^*  (United States)

Author keywords

Additives; Copper; Direct metallization; Pulse plating; Ruthenium

Indexed keywords

BLOCK COPOLYMERS; COPPER; COPPER DEPOSITS; ELECTROPLATING; METALLIZING; POLYETHYLENE GLYCOLS; POLYETHYLENE OXIDES; POLYMERS; POLYPROPYLENE OXIDES; RUTHENIUM;

ALTERNATIVE METHODS; CONTINUOUS PLATINGS; COPPER ELECTRODEPOSITIONS; COPPER NUCLEATIONS; DIRECT METALLIZATION; INITIAL STAGES; NON UNIFORMITIES; NUCLEUS DENSITIES; ORGANIC ADDITIVES; PLATING CONDITIONS; PLATING PARAMETERS; PULSE PLATING; SIGNIFICANT IMPACTS;

PLATING;

EID: 57749098688     PISSN: 00134686     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.electacta.2008.08.065     Document Type: Article

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