Direct copper electrodeposition on TaN barrier layers

Journal of the Electrochemical Society

Volumn 150, Issue 5, 2003, Pages

  Radisic, Aleksandar ^a   Cao, Yang ^b   Taephaisitphongse, Premratn ^b   West, Alan C ^b   Searson, Peter C ^a  

^a Johns Hopkins University   (United States)

^b Department of Earth and Environmental Sciences   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AUGER ELECTRON SPECTROSCOPY; COPPER; CYCLIC VOLTAMMETRY; DENSITY (SPECIFIC GRAVITY); ELECTRODEPOSITION; FLUORINE COMPOUNDS; GROWTH (MATERIALS); NUCLEATION; ORGANIC COMPOUNDS; SOLUTIONS; SULFUR COMPOUNDS; TOXICITY;

BARRIER LAYERS; CITRATE; COPPER ELECTRODEPOSITION; ETHYLENEDIAMINETETRAACETATE; FLUOROBORATE; SOLUTION CHEMISTRY; TANTALUM NNITRIDE;

TANTALUM COMPOUNDS;

EID: 0037502889     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1565137     Document Type: Article

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