-
1
-
-
45549102129
-
MEMS-based uncooled infrared bolometer arrays: A review
-
F. Niklaus, V. Christian and J. Henrik, "MEMS-based uncooled infrared bolometer arrays: a review," SPIE, 2007, pp. 68360D.
-
(2007)
SPIE
-
-
Niklaus, F.1
Christian, V.2
Henrik, J.3
-
2
-
-
0033908794
-
Highly sensitive infrared temperature sensor using self-heating compensated microbolometers
-
M.V.S. Ramakrishna, G. Karunasiri, P. Neuzil, U. Sridhar and W.J. Zeng, "Highly sensitive infrared temperature sensor using self-heating compensated microbolometers," Sensors and Actuators A: Physical, vol. 79, no. 2, 2000, pp. 122-127.
-
(2000)
Sensors and Actuators A: Physical
, vol.79
, Issue.2
, pp. 122-127
-
-
Ramakrishna, M.V.S.1
Karunasiri, G.2
Neuzil, P.3
Sridhar, U.4
Zeng, W.J.5
-
3
-
-
34249294460
-
Fabrication and performance of microbolometer arrays based on nanostructured vanadium oxide thin films
-
S. Chen, H. Ma, S. Xiang and X. Yi, "Fabrication and performance of microbolometer arrays based on nanostructured vanadium oxide thin films," Smart Materials and Structures, vol. 16, no. 3, 2007, pp. 696-700.
-
(2007)
Smart Materials and Structures
, vol.16
, Issue.3
, pp. 696-700
-
-
Chen, S.1
Ma, H.2
Xiang, S.3
Yi, X.4
-
4
-
-
33747630456
-
High sensitivity 640 × 512 (20 micron pitch) microbolometer FPAs
-
D.F. Murphy, et al., "High sensitivity 640 × 512 (20 micron pitch) microbolometer FPAs," SPIE, 2006, pp. 62061A.
-
(2006)
SPIE
-
-
Murphy, D.F.1
-
5
-
-
39849096411
-
Low temperature fabrication of VOx thin films for uncooled IR detectors by direct current reactive magnetron sputtering method
-
J. Dai, X. Wang, S. He, Y. Huang and X. Yi, "Low temperature fabrication of VOx thin films for uncooled IR detectors by direct current reactive magnetron sputtering method," Infrared Physics & Technology, vol. 51, no. 4, 2007, pp. 287-291.
-
(2007)
Infrared Physics & Technology
, vol.51
, Issue.4
, pp. 287-291
-
-
Dai, J.1
Wang, X.2
He, S.3
Huang, Y.4
Yi, X.5
-
6
-
-
0032137158
-
Monolithic two-dimensional arrays of micromachined microstructures for infrared applications
-
B.E. Cole, R.E. Higashi and R.A. Wood, "Monolithic two-dimensional arrays of micromachined microstructures for infrared applications," Proceedings of the IEEE, vol. 86, no. 8, 1998, pp. 1679-1686.
-
(1998)
Proceedings of the IEEE
, vol.86
, Issue.8
, pp. 1679-1686
-
-
Cole, B.E.1
Higashi, R.E.2
Wood, R.A.3
-
7
-
-
0010697883
-
Fabrication process for 256 × 256 bolometer-type uncooled infrared detector
-
H. Wada, et al., "Fabrication process for 256 × 256 bolometer-type uncooled infrared detector," SPIE, 1997, pp. 40-51.
-
(1997)
SPIE
, pp. 40-51
-
-
Wada, H.1
-
8
-
-
51849125996
-
A low-cost CMOS compatible serpentine-structured polysilicon-based microbolometer array
-
E. Socher, Y. Sinai and Y. Nemirovsky, "A low-cost CMOS compatible serpentine-structured polysilicon-based microbolometer array," Proc. Transducers, Solid-State Sensors, Actuators and Microsystems, 12th International Conference on, 2003, 2003, pp. 320-323 vol.321.
-
(2003)
Proc. Transducers, Solid-State Sensors, Actuators and Microsystems, 12th International Conference on
, vol.321
, pp. 320-323
-
-
Socher, E.1
Sinai, Y.2
Nemirovsky, Y.3
-
9
-
-
45549109773
-
Amorphous silicon based large format uncooled FPA microbolometer technology
-
T. Schimert, et al., "Amorphous silicon based large format uncooled FPA microbolometer technology," SPIE, 2008, pp. 694023.
-
(2008)
SPIE
, pp. 694023
-
-
Schimert, T.1
-
10
-
-
33747992894
-
Infrared focal plane array incorporating silicon IC process compatible bolometer
-
A. Tanaka, et al., "Infrared focal plane array incorporating silicon IC process compatible bolometer," IEEE Transactions on Electron Devices, vol. 43, no. 11, 1996, pp. 1844-1850.
-
(1996)
IEEE Transactions on Electron Devices
, vol.43
, Issue.11
, pp. 1844-1850
-
-
Tanaka, A.1
-
11
-
-
0042137081
-
Silicon ic process compatible thin metal film post-processing module
-
D. Wijngaards, M. Bartek and R.F. Wolffenbuttel, "Silicon ic process compatible thin metal film post-processing module," Sensors and Actuators A: Physical, vol. 68, no. 1-3, 1998, pp. 419-428.
-
(1998)
Sensors and Actuators A: Physical
, vol.68
, Issue.1-3
, pp. 419-428
-
-
Wijngaards, D.1
Bartek, M.2
Wolffenbuttel, R.F.3
-
12
-
-
1542271426
-
The experimental study of high TCR Pt thin films for thermal sensors
-
K. Tsutsumi, A. Yamashita and H. Ohji, "The experimental study of high TCR Pt thin films for thermal sensors," Proc. Sensors, 2002. Proceedings of IEEE, 2002, pp. 1002-1005 vol.1002.
-
(2002)
Proc. Sensors, 2002. Proceedings of IEEE
, vol.1002
, pp. 1002-1005
-
-
Tsutsumi, K.1
Yamashita, A.2
Ohji, H.3
-
13
-
-
33847379735
-
Design of low-temperature CMOS-process compatible membrane fabricated with sacrificial aluminum layer for thermally isolated applications
-
K.-M. Chang, R.-J. Lin and I.C. Deng, "Design of low-temperature CMOS-process compatible membrane fabricated with sacrificial aluminum layer for thermally isolated applications," Sensors and Actuators, A: Physical, vol. 134, no. 2, 2007, pp. 660-667.
-
(2007)
Sensors and Actuators, A: Physical
, vol.134
, Issue.2
, pp. 660-667
-
-
Chang, K.-M.1
Lin, R.-J.2
Deng, I.C.3
-
14
-
-
33744458708
-
Design and characterization of adaptive microbolometers
-
W.-B. Song and J.J. Talghader, "Design and characterization of adaptive microbolometers," Journal of Micromechanics and Microengineering, vol. 16, no. 5, 2006, pp. 1073-1079.
-
(2006)
Journal of Micromechanics and Microengineering
, vol.16
, Issue.5
, pp. 1073-1079
-
-
Song, W.-B.1
Talghader, J.J.2
-
15
-
-
26444598465
-
Micromachined infrared sensors with device-level encapsulation
-
A. Dave, C.-B. Zeynep and P.B. Donald, "Micromachined infrared sensors with device-level encapsulation," SPIE, 2005, pp. 460-469.
-
(2005)
SPIE
, pp. 460-469
-
-
Dave, A.1
Zeynep, C.-B.2
Donald, P.B.3
-
16
-
-
0942268200
-
Low-cost uncooled infrared detectors in CMOS process
-
S. Eminoglu, D.S. Tezcan, M.Y. Tanrikulu and T. Akin, "Low-cost uncooled infrared detectors in CMOS process," Sensors and Actuators A: Physical, vol. 109, no. 1-2, 2003, pp. 102-113.
-
(2003)
Sensors and Actuators A: Physical
, vol.109
, Issue.1-2
, pp. 102-113
-
-
Eminoglu, S.1
Tezcan, D.S.2
Tanrikulu, M.Y.3
Akin, T.4
-
17
-
-
0037718542
-
A low-cost uncooled infrared microbolometer detector in standard CMOS technology
-
D.S. Tezcan, S. Eminoglu and T. Akin, "A low-cost uncooled infrared microbolometer detector in standard CMOS technology," IEEE Transactions on Electron Devices, vol. 50, no. 2, 2003, pp. 494-502.
-
(2003)
IEEE Transactions on Electron Devices
, vol.50
, Issue.2
, pp. 494-502
-
-
Tezcan, D.S.1
Eminoglu, S.2
Akin, T.3
-
18
-
-
34247554283
-
Fabricating nanoscale device features using the 2-step NERIME nanolithography process
-
S.F. Gilmartin, K. Arshak, D. Collins, O. Korostynska and A. Arshak, "Fabricating nanoscale device features using the 2-step NERIME nanolithography process," Microelectronic Engineering, vol. 84, no. 5-8, 2007, pp. 833-836.
-
(2007)
Microelectronic Engineering
, vol.84
, Issue.5-8
, pp. 833-836
-
-
Gilmartin, S.F.1
Arshak, K.2
Collins, D.3
Korostynska, O.4
Arshak, A.5
-
19
-
-
0001197855
-
Microscopic uniformity in plasma etching
-
R.A. Gottscho, C.W. Jurgensen and D.J. Vitkavage, "Microscopic uniformity in plasma etching," Journal of Vacuum Science & Technology B: Microelectronics Processing and Phenomena, vol. 10, no. 5, 1992, pp. 2133-2147.
-
(1992)
Journal of Vacuum Science & Technology B: Microelectronics Processing and Phenomena
, vol.10
, Issue.5
, pp. 2133-2147
-
-
Gottscho, R.A.1
Jurgensen, C.W.2
Vitkavage, D.J.3
-
20
-
-
0010402021
-
Influence of bias heating on a titanium bolometer infrared sensor
-
A. Tanaka, et al., "Influence of bias heating on a titanium bolometer infrared sensor," SPIE, 1997, pp. 198-209.
-
(1997)
SPIE
, pp. 198-209
-
-
Tanaka, A.1
-
21
-
-
84944058305
-
Analysis of resistivity in nano-interconnect: Full range (4.2-300 K) temperature characterization
-
International
-
J.F. Guillaumond, et al., "Analysis of resistivity in nano-interconnect: full range (4.2-300 K) temperature characterization," Proc. Interconnect Technology Conference, 2003. Proceedings of the IEEE 2003 International, 2003, pp. 132-134.
-
(2003)
Proc. Interconnect Technology Conference, 2003. Proceedings of the IEEE
, pp. 132-134
-
-
Guillaumond, J.F.1
-
22
-
-
84943240375
-
Scaling laws for the resistivity increase of sub-100 nm interconnects
-
W. Steinhoegl, G. Schindler, G. Steinlesberger, M.A.T.M. Traving and M.A.E.M. Engelhardt, "Scaling laws for the resistivity increase of sub-100 nm interconnects," Proc. Simulation of Semiconductor Processes and Devices, 2003. SISPAD 2003, 2003, pp. 27-30.
-
(2003)
Proc. Simulation of Semiconductor Processes and Devices, 2003. SISPAD
, pp. 27-30
-
-
Steinhoegl, W.1
Schindler, G.2
Steinlesberger, G.3
Traving, M.A.T.M.4
Engelhardt, M.A.E.M.5
-
23
-
-
29244444803
-
Scaling analysis of multilevel interconnect temperatures for high-performance ICs
-
I. Sungjun, N. Srivastava, K. Banerjee and K.E.A.G.K.E. Goodson, "Scaling analysis of multilevel interconnect temperatures for high-performance ICs," Electron Devices, IEEE Transactions on, vol. 52, no. 12, 2005, pp. 2710-2719.
-
(2005)
Electron Devices, IEEE Transactions on
, vol.52
, Issue.12
, pp. 2710-2719
-
-
Sungjun, I.1
Srivastava, N.2
Banerjee, K.3
Goodson, K.E.4
|