메뉴 건너뛰기




Volumn , Issue , 2008, Pages 131-134

Uncooled IR nanobolometers fabricated by electron beam lithography and a MEMS/CMOS process

Author keywords

CMOS; IR; MEMS; Nanobolometer; TCR

Indexed keywords


EID: 55449096889     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/NANO.2008.46     Document Type: Conference Paper
Times cited : (5)

References (23)
  • 1
    • 45549102129 scopus 로고    scopus 로고
    • MEMS-based uncooled infrared bolometer arrays: A review
    • F. Niklaus, V. Christian and J. Henrik, "MEMS-based uncooled infrared bolometer arrays: a review," SPIE, 2007, pp. 68360D.
    • (2007) SPIE
    • Niklaus, F.1    Christian, V.2    Henrik, J.3
  • 3
    • 34249294460 scopus 로고    scopus 로고
    • Fabrication and performance of microbolometer arrays based on nanostructured vanadium oxide thin films
    • S. Chen, H. Ma, S. Xiang and X. Yi, "Fabrication and performance of microbolometer arrays based on nanostructured vanadium oxide thin films," Smart Materials and Structures, vol. 16, no. 3, 2007, pp. 696-700.
    • (2007) Smart Materials and Structures , vol.16 , Issue.3 , pp. 696-700
    • Chen, S.1    Ma, H.2    Xiang, S.3    Yi, X.4
  • 4
    • 33747630456 scopus 로고    scopus 로고
    • High sensitivity 640 × 512 (20 micron pitch) microbolometer FPAs
    • D.F. Murphy, et al., "High sensitivity 640 × 512 (20 micron pitch) microbolometer FPAs," SPIE, 2006, pp. 62061A.
    • (2006) SPIE
    • Murphy, D.F.1
  • 5
    • 39849096411 scopus 로고    scopus 로고
    • Low temperature fabrication of VOx thin films for uncooled IR detectors by direct current reactive magnetron sputtering method
    • J. Dai, X. Wang, S. He, Y. Huang and X. Yi, "Low temperature fabrication of VOx thin films for uncooled IR detectors by direct current reactive magnetron sputtering method," Infrared Physics & Technology, vol. 51, no. 4, 2007, pp. 287-291.
    • (2007) Infrared Physics & Technology , vol.51 , Issue.4 , pp. 287-291
    • Dai, J.1    Wang, X.2    He, S.3    Huang, Y.4    Yi, X.5
  • 6
    • 0032137158 scopus 로고    scopus 로고
    • Monolithic two-dimensional arrays of micromachined microstructures for infrared applications
    • B.E. Cole, R.E. Higashi and R.A. Wood, "Monolithic two-dimensional arrays of micromachined microstructures for infrared applications," Proceedings of the IEEE, vol. 86, no. 8, 1998, pp. 1679-1686.
    • (1998) Proceedings of the IEEE , vol.86 , Issue.8 , pp. 1679-1686
    • Cole, B.E.1    Higashi, R.E.2    Wood, R.A.3
  • 7
    • 0010697883 scopus 로고    scopus 로고
    • Fabrication process for 256 × 256 bolometer-type uncooled infrared detector
    • H. Wada, et al., "Fabrication process for 256 × 256 bolometer-type uncooled infrared detector," SPIE, 1997, pp. 40-51.
    • (1997) SPIE , pp. 40-51
    • Wada, H.1
  • 9
    • 45549109773 scopus 로고    scopus 로고
    • Amorphous silicon based large format uncooled FPA microbolometer technology
    • T. Schimert, et al., "Amorphous silicon based large format uncooled FPA microbolometer technology," SPIE, 2008, pp. 694023.
    • (2008) SPIE , pp. 694023
    • Schimert, T.1
  • 10
    • 33747992894 scopus 로고    scopus 로고
    • Infrared focal plane array incorporating silicon IC process compatible bolometer
    • A. Tanaka, et al., "Infrared focal plane array incorporating silicon IC process compatible bolometer," IEEE Transactions on Electron Devices, vol. 43, no. 11, 1996, pp. 1844-1850.
    • (1996) IEEE Transactions on Electron Devices , vol.43 , Issue.11 , pp. 1844-1850
    • Tanaka, A.1
  • 11
    • 0042137081 scopus 로고    scopus 로고
    • Silicon ic process compatible thin metal film post-processing module
    • D. Wijngaards, M. Bartek and R.F. Wolffenbuttel, "Silicon ic process compatible thin metal film post-processing module," Sensors and Actuators A: Physical, vol. 68, no. 1-3, 1998, pp. 419-428.
    • (1998) Sensors and Actuators A: Physical , vol.68 , Issue.1-3 , pp. 419-428
    • Wijngaards, D.1    Bartek, M.2    Wolffenbuttel, R.F.3
  • 12
    • 1542271426 scopus 로고    scopus 로고
    • The experimental study of high TCR Pt thin films for thermal sensors
    • K. Tsutsumi, A. Yamashita and H. Ohji, "The experimental study of high TCR Pt thin films for thermal sensors," Proc. Sensors, 2002. Proceedings of IEEE, 2002, pp. 1002-1005 vol.1002.
    • (2002) Proc. Sensors, 2002. Proceedings of IEEE , vol.1002 , pp. 1002-1005
    • Tsutsumi, K.1    Yamashita, A.2    Ohji, H.3
  • 13
    • 33847379735 scopus 로고    scopus 로고
    • Design of low-temperature CMOS-process compatible membrane fabricated with sacrificial aluminum layer for thermally isolated applications
    • K.-M. Chang, R.-J. Lin and I.C. Deng, "Design of low-temperature CMOS-process compatible membrane fabricated with sacrificial aluminum layer for thermally isolated applications," Sensors and Actuators, A: Physical, vol. 134, no. 2, 2007, pp. 660-667.
    • (2007) Sensors and Actuators, A: Physical , vol.134 , Issue.2 , pp. 660-667
    • Chang, K.-M.1    Lin, R.-J.2    Deng, I.C.3
  • 15
    • 26444598465 scopus 로고    scopus 로고
    • Micromachined infrared sensors with device-level encapsulation
    • A. Dave, C.-B. Zeynep and P.B. Donald, "Micromachined infrared sensors with device-level encapsulation," SPIE, 2005, pp. 460-469.
    • (2005) SPIE , pp. 460-469
    • Dave, A.1    Zeynep, C.-B.2    Donald, P.B.3
  • 17
    • 0037718542 scopus 로고    scopus 로고
    • A low-cost uncooled infrared microbolometer detector in standard CMOS technology
    • D.S. Tezcan, S. Eminoglu and T. Akin, "A low-cost uncooled infrared microbolometer detector in standard CMOS technology," IEEE Transactions on Electron Devices, vol. 50, no. 2, 2003, pp. 494-502.
    • (2003) IEEE Transactions on Electron Devices , vol.50 , Issue.2 , pp. 494-502
    • Tezcan, D.S.1    Eminoglu, S.2    Akin, T.3
  • 18
    • 34247554283 scopus 로고    scopus 로고
    • Fabricating nanoscale device features using the 2-step NERIME nanolithography process
    • S.F. Gilmartin, K. Arshak, D. Collins, O. Korostynska and A. Arshak, "Fabricating nanoscale device features using the 2-step NERIME nanolithography process," Microelectronic Engineering, vol. 84, no. 5-8, 2007, pp. 833-836.
    • (2007) Microelectronic Engineering , vol.84 , Issue.5-8 , pp. 833-836
    • Gilmartin, S.F.1    Arshak, K.2    Collins, D.3    Korostynska, O.4    Arshak, A.5
  • 20
    • 0010402021 scopus 로고    scopus 로고
    • Influence of bias heating on a titanium bolometer infrared sensor
    • A. Tanaka, et al., "Influence of bias heating on a titanium bolometer infrared sensor," SPIE, 1997, pp. 198-209.
    • (1997) SPIE , pp. 198-209
    • Tanaka, A.1
  • 21
    • 84944058305 scopus 로고    scopus 로고
    • Analysis of resistivity in nano-interconnect: Full range (4.2-300 K) temperature characterization
    • International
    • J.F. Guillaumond, et al., "Analysis of resistivity in nano-interconnect: full range (4.2-300 K) temperature characterization," Proc. Interconnect Technology Conference, 2003. Proceedings of the IEEE 2003 International, 2003, pp. 132-134.
    • (2003) Proc. Interconnect Technology Conference, 2003. Proceedings of the IEEE , pp. 132-134
    • Guillaumond, J.F.1
  • 23
    • 29244444803 scopus 로고    scopus 로고
    • Scaling analysis of multilevel interconnect temperatures for high-performance ICs
    • I. Sungjun, N. Srivastava, K. Banerjee and K.E.A.G.K.E. Goodson, "Scaling analysis of multilevel interconnect temperatures for high-performance ICs," Electron Devices, IEEE Transactions on, vol. 52, no. 12, 2005, pp. 2710-2719.
    • (2005) Electron Devices, IEEE Transactions on , vol.52 , Issue.12 , pp. 2710-2719
    • Sungjun, I.1    Srivastava, N.2    Banerjee, K.3    Goodson, K.E.4


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.