A versatile and flexible low-temperature full-wafer bonding process of monolithic 3D microfluidic structures in SU-8

Journal of Micromechanics and Microengineering

Volumn 18, Issue 9, 2008, Pages

  Steigert, J ^a   Brett, O ^a   Muller C ^a   Strasser, M ^a   Wangler, N ^a   Reinecke, H ^a,b   Daub, M ^a   Zengerle, R ^a,b  

^a UNIVERSITY OF FREIBURG   (Germany)

^b Institute of Micromachining and Information Technology   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 54749150974     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/18/9/095013     Document Type: Article

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