Contact resistance and thermal cycling reliability of the flip-chip joints processed with Cu-Sn mushroom bumps

Journal of Korean Institute of Metals and Materials

Volumn 46, Issue 9, 2008, Pages 585-592

  Lim, Su Kyum ^a   Choi, Jin Won ^b   Kim, Young Ho ^c   Oh, Tae Sung ^a  

^a Hong Ik University   (South Korea)

^b Samsung Electro Mechanics   (South Korea)

^c Hanyang University   (South Korea)

Author keywords

Chip on glass; Contact resistance; Flip chip; Mushroom bump; Thermal cycling

Indexed keywords

EID: 54449092063     PISSN: 17388228     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (22)

1. J. W. Wan, W. J. Zhang, and D. J. Bergstrom, J. Microelectron. Reliab. 38, 67 (2007).
2. T. Braun, K. F. Becker, M. Koch, V Bader, R. Aschenbrenner, and H. Reichl, J. Microelectron. Reliab. 46, 144 (2006).
3. L. Han and J. Zhong, J. Microelectron. Eng. 85, 1568 (2008).
4. Y. N. Kim, J. M. Koo, S. K. Park, and S. B. Jung, J. Korean Inst. Met. Mater. 46, 33 (2008).
5. J. H. Lee, G. T. Lim, S. T. Yang, M. S. Suh, Q. H. Chung, K. Y. Byun, and Y. Bae Park, J. Korean Inst. Met. Mater. 46, 310(2008).
6. U. B. Kang and Y. H. Kim, Proc. 3rd Int. Symp. Electron. Mater. & Packag. p. 12 (2001).
7. U. B. Kang and Y. H. Kim, IEEE Trans. Comp. Packag. Technol. 27, 253 (2004).
8. H. Kristiansen and J. Liu, IEEE Trans. Comp. Packag. Manufact. Technol. A 21, 208 (1998).
9. Y. P. Wu, M. O. Alam, Y. C. Chan, B. Y. Wu, Microelectron. Reliab. 44, 295 (2004).
10. M. J. Rizvi, H. Lu, C. Bailey, Y. C. Chan, M. Y. Lee, and C. H. Pang, J. Microelectron. Engineer. 85, 238 (2008).
11. M. Mori, Y. Kizaki, M. Saito, and A. Hongu, IEEE Trans. Comp. Hybrids, Manufact. Technol. 16, 852 (1993).
12. L. K. Teh, E. Anto, C. C. Wong, S. G. Mhaisalkar, E. H. Wong, P. S. Teo, and Z. Chen, Thin Solid Films 462, 446 (2004).
13. K. Y. Lee, Y. H. Lee, Y. H. Kim, and T. S. Oh, J. Korean Inst. Met. Mater. 43, 1 (2005).
14. L. K. The, C. C. Wong, S, Mhaisalkar, K. Ong, P. S. Teo, and E. H. Wong, J. Electron. Mater. 33, 271 (2004).
15. M. J. Yim, J. S. Hwang, W. Kwon, K. W. Jang, and K. W. Paik, IEEE Trans. Electronics Packag. Manufact. 26, 150 (2003).
16. Y. W. Chiu, Y.C. Chan, S.M. Lui, Microelectron. Reliab. 42, 1945 (2002).
17. Y. T. Hsieh, Proc. Inter. Symp. Electron. Mater. Packag. (2002) p.157.
18. JEDEC Specification, Coplanarity Test for Surface-Mount Semiconductor Devices, JESD22-B108A.
19. C. W. Ju, K. H. Pack, H. T. Lee and Y. C. Hyun, J. Korean Phys. Soc. 42, S574 (2003).
20. J. W. Nah and K. W. Paik, Proc. Electron. Comp. Technol. Conf. (2001) p.790.
21. D. K. Schroder, Semiconductor Material and Device Characterization, 2nd ed., John Wiley & Sons, Inc., New York (1998) p.10.
22. K. N. Tu, Mater. Chemistry & Physics 46, 217 (1996).