Effect of under bump metallization (UBM) on interfacial reaction and shear strength of electroplated pure tin solder bump

Journal of Korean Institute of Metals and Materials

Volumn 46, Issue 1, 2008, Pages 33-38

  Kim, Yu Na ^a   Koo, Ja Myeong ^a   Park, Sun Kyu ^a   Jung, Seung Boo ^a  

^a Sungkyunkwan University   (South Korea)

Author keywords

Flip chip; Interfacial reaction; Intermetallic compound (IMC); Multiple reflows; Pure tin (Sn); Shear test; Under bump metallization (UBM)

Indexed keywords

EID: 38849168109     PISSN: 17388228     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (9)

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