Experimental observations on nonlinear phenomena in transducer assembly for thermosonic Flip-Chip bonding

Microelectronic Engineering

Volumn 85, Issue 7, 2008, Pages 1568-1576

  Han, Lei ^a   Zhong, Jue ^a  

^a CENTRAL SOUTH UNIVERSITY   (China)

Author keywords

Flip chip die; Laser vibrometer; Nonlinear dynamics; PZT transducer assembly; Thermosonic bonding

Indexed keywords

BONDING; FLIP CHIP DEVICES; NONLINEAR SYSTEMS; VELOCITY; VIBRATION MEASUREMENT;

FLIP-CHIP DIE; LASER VIBROMETER; PZT TRANSDUCER ASSEMBLY; THERMOSONIC BONDING;

PIEZOELECTRIC TRANSDUCERS;

EID: 46549083445     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2008.02.017     Document Type: Article

References (14)

1. Ravi Kumar Burla, Nickel Wire Bonding for High Temperature SiC Devices and for Pre-Release Wire Bonding Process [D], MS Thesis, Case Western Reserve University, USA, 2000.
2. Sa-Yoon K., Williams Paul.M., and Yung-Cheng L. Modeling and experimental studies on thermosonic flip-chip bonding [J]. IEEE Transactions on Components, Packaging, and Manufacturing Technology - Part B 18 4 (1995) 728-733
3. Or S.W., Chan H.L.W., and Yuen C.W. Dynamics of an ultrasonic transducer used for wire bonding [J]. IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control 45 6 (1998) 1453-1460
4. Qing T., Brian S., Bond L.J., and Lee Y.C. Thermosonic flip-chip bonding using longitudinal ultrasonic vibration [J]. IEEE Transaction on Components, Packaging and Manufacturing Technology - Part B 21 1 (1998) 53-58
5. Qing T., Brian S., Bond L.J., and Lee Y.C. Thermosonic flip chip bonding system with a self-planarization feature using polymer [J]. IEEE Transaction on Components, Hybrids, and Manufacturing Technology 32 5 (1998) 1-8
6. Thomas Sattel, Michael Brokelmann, A simple transducer model for longitudinal flip-chip bonding, in: 2002 IEEE Ultrasonics Symposium, pp. 695-698.
7. Jiromaru T., Hiroyuki Y., Kazuyoshi K., and Yoshiaki O. Welding characteristics and temperature rise of high frequency and complex vibration ultrasonic wire bonding [J]. Ultrasonics 36 2 (1998) 59-65
8. Jiromaru T., Tsutomu S., Hayato O., Soichi T., and Yoshiki H. Complex vibration ultrasonic welding system with large area welding tops [J]. Ultrasonics 40 2 (2002) 361-364
9. Zhili L., Lei H., Yunxin W., and Hongquan Z. Effect of different temperature on strength of thermosonic bonding (in Chinese) [J]. Transactions of the China Welding Institution 26 8 (2005) 23-38
10. Zhou Hongquan, Han Lei, Zhong Jue, Experimental studies of frequency characteristic on transducer power supply and vibration system in ultrasonic bonding system, in: The 7th IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP'05), June 2005, pp. 426-429.
11. Hongquan Zhou, Experimental studies of power amplifier and transducer of ultrasonic bonder [D], MS Thesis, Central South University, China, 2006.
12. Wenhu Xu, Dynamical characteristics study of ultrasonic bonding transducer by using laser Doppler vibrometer [D], MS Thesis, Central South University, China, 2006.
13. WANG Fuliang, HAN Lei, ZHONG Jue, Experiments on the bonding interface vibration of thermosonic flip-chip, in: The 7th IEEE CPMT Conference on High Density Microsystem Design, Packaging and Failure Analysis (HDP05), June 2005, pp. 33-35.
14. Han L., Zhong J., and Gao G. Effect of tightening torque on transducer dynamics and bond strength in wire bonding. Sensors and Actuators A 141 (2008) 695-702