Enhancement of the wettability and solder joint reliability at the Sn-9Zn-0.5Ag lead-free solder alloy-Cu interface by Ag precoating

Journal of Alloys and Compounds

Volumn 360, Issue 1-2, 2003, Pages 217-224

  Chang, Tao Chih ^a   Hsu, Ying Tun ^b   Hon, Min Hsiung ^a   Wang, Moo Chin ^b  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

^b NATIONAL UNIVERSITY OF KAOHSIUNG   (Taiwan)

Author keywords

Ag precoating; Diffusion coefficient; Intermetallic compound; Solder joint reliability; Wettability

Indexed keywords

ADHESION; DIFFUSION; INTERMETALLICS; SILVER PLATING; SOLDERED JOINTS; WETTING;

INTERFACIAL ADHESION STRENGTH;

SOLDERING ALLOYS;

EID: 0141791346     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0925-8388(03)00300-1     Document Type: Article

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