Electromigration reliability and morphologies of 62Sn-36Pb-2Ni and 62Sn-36Pb-2Cu flip-chip solder joints

IEEE Transactions on Components and Packaging Technologies

Volumn 30, Issue 3, 2007, Pages 526-531

  Lai, Yi Shao ^a   Lee, Chiu Wen ^a  

^a ADVANCED SEMICONDUCTOR ENGINEERING INC   (Taiwan)

Author keywords

Electromigration; Flip chip; Interconnections; Reliability

Indexed keywords

AMBIENT TEMPERATURES; AVERAGE CURRENT DENSITIES; CROSS SECTIONS; ELECTROMIGRATION RELIABILITIES; FATIGUE LIVES; FATIGUE RELIABILITIES; FLIP-CHIP; INTERCONNECTIONS; INTERFACIAL INTERMETALLICS; SOLDER JOINTS; TERNARY SOLDERS; TEST CONDITIONS;

BRAZING; ELECTROMIGRATION; FLIP CHIP DEVICES; INTERMETALLICS; LEAD; LEAD ALLOYS; LEAD COMPOUNDS; NICKEL; RELIABILITY; SCANNING ELECTRON MICROSCOPY; SOLDERING ALLOYS; WELDING;

TIN;

EID: 51349108024     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2007.898681     Document Type: Article

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