Effect of test conditions on electromigration reliability of Sn-Ag-Cu flip-chip solder interconnects

Journal of Electronic Packaging

Volumn 129, Issue 1, 2007, Pages 56-62

  Lai, Yi Shao ^a,b   Lee, Chiu Wen ^b   Kao, Chin Li ^b  

^a ASME

^b ADVANCED SEMICONDUCTOR ENGINEERING INC   (Taiwan)

Author keywords

Electromigration; Electrothermal coupling analysis; Flip chip; Reliability; Solder bump

Indexed keywords

CURRENT DENSITY; ELECTROMIGRATION; FATIGUE OF MATERIALS; FLIP CHIP DEVICES; RELIABILITY THEORY; SOLDERING ALLOYS;

ELECTROTHERMAL COUPLING ANALYSIS; FATIGUE RELIABILITY; TEMPERATURE OPERATION LIFE TEST (HTOL);

OPTICAL INTERCONNECTS;

EID: 35348848737     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.2429710     Document Type: Article

References (20)

1. Tu, K. N., 2003, "Recent Advances on Electro-Migration in Very-Large-Scale-Integration of Interconnects," J. Appl. Phys., 94(9), pp. 5451-5473.
2. Choi, W. J., Yeh, E. C. C. and Tu, K. N., 2003, "Mean-Time-to- Failure Study of Flip Chip Solder Joints on Cu/Ni(V)/Al Thin-Film Under-Bump-Metallization," J. Appl. Phys., 94(9), pp. 5665-5671.
3. Nah, J. W., Paik, K. W., Suh, J. O., and Tu, K. N., 2003, "Mechanism of Electromigration-Induced Failure in the 97Pb-3Sn and 37Pb-63Sn Composite Solder Joints," J. Appl. Phys., 94(12), pp. 7560-7566.
4. Zheng, P.-J., Hung, C.-Y., Lee, Z.-J., Lee, C.-W., Chung, C.-S., and Wu, J.-D., 2003, "A Comparison of Electromigration and Thermal Fatigue Performance Between Thin and Thick Film UBM," Proceedings 36th International Symposium on Microelectronics, Boston, MA, pp. 93-99.
5. Rinne, G. A., 2003, "Issues in Accelerated Electromigration of Solder Bumps," Microelectron. Reliab., 43(12), pp. 1975-1980.
6. Shao, T. L., Chen, Y. H., Chiu, S. H., and Chen, C., 2004, "Electromigration Failure Mechanisms for SnAg3.5 Solder Bumps on Ti/Cr-Cu/Cu and Ni(P)/Au Metallization Pads," J. Appl. Phys., 96(8), pp. 4518-4524.
7. Lai, Y.-S., Lee, C.-W., Shao, Y.-H., and Liu, Y.-H., 2004, "Electromigration of Sn-Pb-Ni and Sn-Pb-Cu Solder Bumps in Flip-Chip Packages," Proceedings 6th International Conference on Electronics Materials and Packaging, Penang, Malaysia, pp. 314-319.
8. Wu, J.-D., Zheng, P.-J., Lee, C.-W., Hung, S.-C., and Lee, J.-J., 2006, "A Study in Flip-Chip UBM/Bump Reliability With Effects of SnPb Solder Composition," Microelectron. Reliab., 46(1), pp. 41-52.
9. Lai, Y.-S., and Kao, C.-L., 2006, "Electrothermal Coupling Analysis of Current Crowding and Joule Heating in Flip-Chip Packages," Microelectron. Reliab., 46(8), pp. 1357-1368.
10. Lai, Y.-S., and Kao, C.-L., 2006, "Characteristics of Current Crowding in Flip-Chip Solder Bumps," Microelectron. Reliab., 46(5-6), pp. 915-922.
11. Shaukatullah, H., Gaynes, M. A., and White, L. H., 1994, "A Non-Dimensional Correlation for the External Thermal Characteristics of Surface Mount Metal Quad Flat Packs," Proceedings 1994 Intersociety Conference on Thermal Phenomena in Electronic Systems, Washington, DC, pp. 237-244.
12. Guenin, B. M., Marrs, R. C., and Molnar, R. J., 1995, "Analysis of a Thermally Enhanced Ball Grid Array Package," IEEE Trans, Compon., Packag. Manuf. Technol., Part A, 18(4), pp. 749-757.
13. Zahn, B. A., and Stout, R. P., 1997, "Evaluation of Isothermal and Isoflux Natural Convection Coefficient Correlations for Utilization in Electronic Package Level Thermal Analysis," Proceedings IEEE Semiconductor Thermal Measurement and Management Symposium, Austin, TX, pp. 24-31.
14. Ellison, G. N., 1989, Thermal Computations for Electronic Equipment, R. E. Krieger, Malabar.
15. Lai, Y.-S., Sathe, S., Kao, C.-L., and Lee, C.-W., 2005, "Integrating Electrothermal Coupling Analysis in the Calibration of Experimental Electromigration Reliability of Flip-Chip Packages," Proceedings 55th Electronic Components and Technology Conference, Lake Buena Vista, FL, pp. 1421-1426.
16. Lai, Y.-S., and Kao, C.-L., 2006, "Calibration of Electromigration Reliability of Flip-Chip Packages by Electrothermal Coupling Analysis," J. Electron. Mater., 35(5), pp. 972-977.
17. Ye, H., Basaran, C., and Hopkins, D. C., 2003, "Thermomigration in Pb-Sn Solder Joints Under Joule Heating During Electric Current Stressing," Appl. Phys. Lett., 82(7), pp. 1045-1047.
18. Huang, A. T., Gusak, A. M., Tu, K. N., and Lai, Y.-S., 2006, "Thermomigration in SnPb Composite Flip Chip Solder Joints," Appl. Phys. Lett., 88, 141911.
19. Lee, H.-T., Chen, M.-H., Jao, H.-M., and Hsu, C.-J., 2004, "Effect of Adding Sb on Microstructure and Adhesive Strength of Sn-Ag Solder Joints," J. Electron. Mater., 33(9), pp. 1048-1054,
20. Du, M.-Y. Chen, C.-M., and Chen, S.-W., 2003, "Effects Upon Interfacial Reactions by Electric Currents of Reversing Directions," Mater. Chem. Phys., 82(3), pp. 818-825.