Effect of entropy production on microstructure change in eutectic SnPb flip chip solder joints by thermomigration

Applied Physics Letters

Volumn 89, Issue 22, 2006, Pages

  Ouyang, Fan Yi ^a   Tu, K N ^a   Lai, Yi Shao ^b   Gusak, Andriy M ^c  

^a UNIVERSITY OF CALIFORNIA   (United States)

^b ADVANCED SEMICONDUCTOR ENGINEERING INC   (Taiwan)

^c CHERKASY NATIONAL UNIVERSITY   (Ukraine)

Author keywords

[No Author keywords available]

Indexed keywords

FLIP CHIP SOLDER JOINTS; LAMELLAR INTERFACES; LAMELLAR MICROSTRUCTURES; THERMOMIGRATION;

ENTROPY; EUTECTICS; FLIP CHIP DEVICES; INTERFACES (MATERIALS); MICROSTRUCTURE; THERMAL EFFECTS; TIN COMPOUNDS;

SOLDERED JOINTS;

EID: 33751585505     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2385205     Document Type: Article

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